Newly Published Guide on Measurements of Openings and Vias in Glass
By Ilona Schmidt, Corning Incorporated
SEMI recently published a new standard SEMI 3D22, Guide on Measurements of Openings and Vias in Glass. With the emerging use of glass as a non-silicone, dielectric alternative for the semiconductor industry, through glass vias, blind vias, and openings in glass are coming into focus for passive or active devices. However, there are few – or no – agreed upon test methods for measuring the physical and dimensional properties of through glass vias or other openings in glass as all existing standards are based on silicon or opaque base materials. For instance, surface roughness of the openings is critical to the filling process, but to date, no relevant measurement standards exist. Alignment of patterns and structures in the process are also topic of the standard.
This Guide will discuss existing test methods for openings and propose new ones for openings in glass.
This Guide compliments the other SEMI Standards related to glass material for 3D-IC applications below:
- SEMI 3D2, Specification for Glass Carrier Wafers for 3DS-IC Applications
- SEMI 3D11, Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology
- SEMI 3D16, Specification for Glass Base Material for Semiconductor Packaging
- SEMI 3D21, Guide for Describing Glass-Based Material for Use in 3DS-IC Process
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Standards Watch
SEMI
www.semi.org
March 5, 2020
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