DRESDEN, Germany — June 24, 2025 — More than 150 global experts are set to convene in Dresden from June 25–27 for the SEMI 3D & Systems Summit 2025 to explore the latest breakthroughs in 3D packaging and heterogeneous integration. Registration is open.
Themed Heterogeneous Integration: Bolstering Europe’s Resilience, the summit will explore innovations in chiplet architectures, die-to-wafer and wafer-to-wafer hybrid bonding, photonics, and advanced system-level design. From geopolitical dynamics and advanced packaging breakthroughs to high-performance computing and biomedical applications, the program will offer insights into how 3D and heterogeneous integration technologies are reshaping Europe’s semiconductor value chain.
“The SEMI 3D & Systems Summit opens here in Dresden tomorrow to welcome industry leaders, technology innovators, and future talent to exchange ideas and advance collaboration on technologies critical to Europe’s semiconductor future,” said Laith Altimime, President of SEMI Europe. “This year’s focus on heterogeneous integration reflects our shared commitment to strengthening Europe’s resilience and global competitiveness through innovation, and to investing in the next generation of semiconductor professionals who will drive this transformation.”
A key highlight of this year’s Summit is the NextGen Talent session, designed to connect students and young professionals with industry leaders as Europe works to build a strong pipeline of semiconductor talent. This dedicated session will explore how collaboration between academia and industry can help close critical skill gaps and foster innovation. Program highlights include A Day in the Life talks, providing students with first-hand insights into semiconductor careers, and the panel discussion What Fab Managers Want: Talent, Workforce, and HR Perspectives. Additional activities, including a Student Quiz and Flash Mentoring session, will offer valuable opportunities for emerging talent to engage with experienced professionals and explore meaningful career pathways within the industry.
Participating Mentors
- Laith Altimime, President, SEMI Europe
- Bernard Capraro, Senior Manager, University Partnerships & Talent Initiative, SEMI Europe
- Sibo Chen, Sales Account Manager, KLA
- Dirk Drescher, Plant Manager, Robert Bosch Semiconductor Manufacturing Dresden
- Cassandra Melvin, Senior Director, Business Development and Operations, SEMI Europe
- Michael Schaub, Talent Acquisition Manager, Comet
- Daria Schüpbach, Head of Global Talent Acquisition, Comet
- Anne-Mary Yeboah, Technology Manager, SOITEC
Featured Speakers
- Christian Koitzsch, President & Managing Director, European Semiconductor Manufacturing Company (ESMC)
- Dave Thomas, Vice President, Product Management, SPTS Technologies, KLA
- Dirk Drescher, Plant Manager, Robert Bosch Semiconductor Manufacturing Dresden
- Isabella Drolz, Vice President, Marketing & Product Strategy, Comet
- Jan Vardaman, President, TechSearch International
- Jekaterina Viktorova, Founder & CEO, Syenta
- Lode Lauwers, Senior Vice President of Business Development and Strategy, imec
- Peter Jenkins, President & CEO, Infinitesima
- Seung Kang, Senior Vice President, Semiconductor Strategy, Adeia
- Sébastien Dauvé, CEO, CEA-Leti
- Stephan Guttowski, Managing Director, Fraunhofer Group for Microelectronics
- Thomas Kralinski, Saxon State Secretary of Economic Affairs, Labour, Energy and Climate
Global Leaders to Present
3D & Systems Summit presenters include experts from global leaders:
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Exhibition and Networking
The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies in the new exhibition area. Exhibitors include: AEMtec GmbH, Adeia Inc., ASE Global, ASMPT, Besi, Carl Zeiss (ZEISS Microscopy), Comet, Confovis, cyberTECHNOLOGIES, DISCO HI-TEC Europe, FAMES, Fraunhofer IZM-ASSID, Fraunhofer - Verbund Mikroelektronik (FMD), Heidenhain, Kistler AG, Kontron AIS, NanoFocus AG, PLANOPTIK, Precitec Optronik GmbH, SET (Smart Equipment Technology), Syenta, Wooptix.
This year’s networking reception will take place at the Hilton Dresden Hotel on the first day of the event, and the Networking Dinner Cruise is set on a historic paddle steamer on the Elbe River.
3D Summit Premium Sponsors:
- Platinum:
Adeia, ASE, Comet, Confovis, HEIDENHAIN, Lam Research, - Gold:
Evatec, KLA - Event:
CTP, EV Group, imec, MKS Atotech
For more details, please visit the 3D & Systems Summit 2025 website and connect with SEMI Europe on LinkedIn or YouTube @SEMIEurope (#3DSummit).
About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
Contact Information:
Sitong He / SEMI Europe
Phone: +49 151 55462638
Email: [email protected]
Sherrie Gutierrez / SEMI Corporate
Phone: +1 831 889 3800
Email: [email protected]
