Showing 8137 - 8148 of 8245
SEMI Press Release
China Wafer Production Capacity Growth Fastest in World
MILPITAS, Calif. – January 7, 2019 – Unwavering in its drive to build a strong, self-sustaining semiconductor supply chain, China plans more new fab projects than any other region in the world...
Member Press Release
GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED
GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED
Team from ESIEE Paris and Sorbonne University Awarded Grand Prize for Innovative use of MEMS and Mixed-Signal Design in 3D Vibration Energy Harvester...
Member Press Release
MRSI Systems launches MRSI-HVM3P for new applications extending the MRSI-HVM3 die bonder family
MRSI Systems launches MRSI-HVM3P for new applications extending the MRSI-HVM3 die bonder family
BILLERICA, Massachusetts, USA, August 21, 2018 – MRSI Systems (Mycronic Group), is expanding...
SEMI Press Release
SEMI Supports Congressional Response to USTR Regarding China Trade Tariffs
Washington, D.C., July 31, 2018 – SEMI today announced its support for calls on the Trump administration yesterday by nearly 50 members of Congress to remove tariffs on U.S. semiconductor products...
Member Press Release
Picosun aims for even stronger growth with bridge financing while preparing to be listed
ESPOO, Finland, 8th May, 2018 – Picosun Group, a leading provider of ALD (Atomic Layer Deposition) thin film coating technology for global industries, has decided of minimum one and a half million...
SEMI Press Release
SEMI Europe and AENEAS Collaborate to Support European Electronics Industry Growth
Brussels, BELGIUM – 3 September 2018 – SEMI Europe and AENEAS today announced that they have signed a Memorandum of Understanding (MOU) to form a strategic partnership to support the European...
SEMI Press Release
SEMI Announces Re-Election of Board Members
SAN FRANCISCO, Calif. — July 10, 2018 — SEMI today announced the re-election of 10 current members to the SEMI International Board of Directors in accordance with the association's by-laws.
The...
Member Press Release
Stress-free ALD from Picosun
ESPOO, Finland, 28th August, 2018 – Picosun Group, a leading supplier of advanced Atomic Layer Deposition (ALD) thin film coating solutions, reports a method to control and eliminate stress in ALD...
Member Press Release
Groundbreaking micromedicine with Picosun’s ALD solutions
ESPOO, Finland, 24th April, 2018 – Picosun Group, a leading industrial supplier of Atomic Layer Deposition (ALD) thin film coating technology, reports of groundbreaking results in ALD biobarriers for...
Member Press Release
Unveiling Excellence: ViTrox Sets to Showcase Innovation at the 2024 SMTA Wafer-Level Packaging Symposium
PENANG, MALAYSIA - JANUARY 2024 ViTrox, which aims to be the World’s Most Trusted Technology Company, is pleased to announce its participation in the 2024 SMTA Wafer-Level Packaging Symposium at...
Member Press Release
Picosun’s high aspect ratio ALD enables 3D thin-film batteries
ESPOO, Finland, 25th March 2019 – Picosun Group, a leading supplier of advanced ALD (Atomic Layer Deposition) thin film coating technology for industrial production, reports excellent results in...
Member Press Release
Picosun storms over the Asian ALD production market in several key application areas
ESPOO, Finland, 28th June, 2018 – Picosun Group, a leading supplier of advanced Atomic Layer Deposition (ALD) thin film coating technology, breaks through into industrial production in Asia in...