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FOA Meetings
SEMI Press Release
SEMICON Korea 2020 to Showcase AI, Smart Mobility and Manufacturing, MEMS and Sensors, Talent
SEOUL, South Korea – November 19, 2019 – With Korea the world’s largest manufacturer of memory semiconductors and leading in 300mm fab construction in 2019, the region is paving the way to SEMICON...
SEMI Press Release
North American Semiconductor Equipment Industry Posts October 2019 Billings
MILPITAS, Calif. — November 19, 2019 — North America-based manufacturers of semiconductor equipment posted $2.11 billion in billings worldwide in October 2019 (three-month average...
SEMI Press Release
SEMI, Partners Launch Largest Microelectronics Education Initiative Co-Funded by Erasmus+ Program
BRUSSELS, Belgium – November 19, 2019 – SEMI and 19 partners from 14 countries today launched an initiative to fill the skills gap and boost workforce diversity by tightening collaboration...
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FOA Member Directory
Blog
MEMS and Sensors Fuel Intelligence Movement - Part 2
Part 2 of 2-part series on MSEC 2019 highlights. Read Part 1. Neural Networks on ChipTo be sure, low power is king when bringing machine learning to the sensor edge. Battery-powered, always-on...
Blog
Jim Cable (pSemi) & Herb Huang (Ningbo Semi) Honored for Pioneering RF-SOI Work
The SOI Industry Consortium awarded two luminaries of the semiconductor industry for pioneering advances in RF-SOI, a technology now found in all cellphones. Jim Cable (shown on the left in the photo...
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MSIG News Archive
2020 Blogs
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Published
Title
Link
1
January
MSTC Q&A blog - Next Generation of Mobile Devices Will Be...
Event Presentation
power laser display technology
Dr. Wang Lin from Shenzhen Guangfeng Technology Co., Ltd. presents on the topic of power laser displays.
SEMICON China 2019 - Shanghai, China
Event Presentation
New Optical Films for Implementation of Next Generation AR Head Up Displays (HUDs)
This presentation discusses the development of new optical film technologies for the automotive industry and compares the thermal load placed on various film surfaces.
SEMICON China...
Event Presentation
Packaging Integration - A Complementary Solution to CMOS Scaling
Russell Liu from WLCSP Innovative Technologies discusses Advanced Packaging solutions, trends, and forecasts.
SEMICON China 2019 - Shanghai, China