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Blog
COVID-19: Building Resilience and Maintaining Business Continuity – Views from GLOBALFOUNDRIES (Part 1)
Part 1 of 2Read Part 2. While companies navigate the ongoing COVID-19 crisis, corporate leaders should be evaluating a number of key business continuity issues as well as steps they can take to...
Blog
CMC Designates Leti’s L-UTSOI Standard Model as Chip Industry FD-SOI Standard
The Compact Model Coalition (CMC) has selected Leti’s L-UTSOI as a standard model for FD-SOI in the industry. The CMC is a working group composed of the major semiconductor companies and is part of...
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Silicon Valley Virtual Forum Bio - Jan Gaudested
Jan Gaudestad is San Francisco based VP of Business Development for Wooptix, a light field imaging company headquartered in Tenerife, Spain, developing advanced technology for the semiconductor...
SEMI Press Release
Global Silicon Wafer Area Shipments Edge Up in First Quarter 2020 Despite COVID-19 Headwinds
MILPITAS, Calif. — May 4, 2020 — Worldwide silicon wafer area shipments rose 2.7 percent to 2,920 million square inches in the first quarter of 2020, compared with fourth-quarter 2019 shipments of...
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Webinar Replay
Semiconductor Outlook—Navigating Through Turbulent Times
Businesses across the globe are facing a host of new challenges in the wake of the COVID-19 outbreak. With supply chains disrupted and markets dislocated, industry leaders are debating how long until...
Event
SEMI Virtual Forum: Semiconductor Outlook—Navigating Through Turbulent Times
Webinar: 8:30am–10:00am Pacific / 11:30am–1:00pm Eastern
Join us to hear industry and market experts discuss the outlook and the impact on manufacturing in the near and long term,...
Event
SEMI Virtual Forum: Semiconductor Outlook—Navigating Through Turbulent Times
Webinar: 8:30am–10:00am Pacific / 11:30am–1:00pm Eastern
Join us to hear industry and market experts discuss the outlook and the impact on manufacturing in the near and long term,...
Member Press Release
Picosun provides ALD technology for several new photonics applications
ESPOO, Finland, 29th April 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, reports several significant new sales...
Member Press Release
CoreFlow’s non-contact chuck reduces backside particle contamination in semiconductor wafers
CoreFlow Ltd., a leading solutions provider of advanced, aeromechanical-based handling and conveying systems, announced a non-contact chuck for silicon wafer processing applications.
The demand for...
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ESD Alliance 2011 Phil Kaufman Award
The Electronic System Design Alliance and The IEEE Council on EDA (CEDA) are proud to honor
Dr. C. L. David Liu
Professor of Computer Science and former president of the National Tsing Hua...