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Event
ESD Alliance CEO Outlook
Organized by
Join us for the ESD Alliance 2019 CEO Outlook Thursday, May 23, at SEMI in Milpitas, Calif. Our moderator, Ed Sperling, editor in chief of...
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SPCC 2026 Bio Wei-Shang Lo
Impact of Wet Bevel Etching on WDC Films and Advanced Interconnect Structures As BEOL scaling continues, the introduction of new interconnect materials such as tungsten-doped carbon (WDC)...
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300 mm Tape Frame FOUP Related Standards Published
300 mm Tape Frame FOUP Related Standards Published
By Hayato Iwamoto, SEMI Japan Region PI&C (Physical Interfaces & Carriers) Technical Committee, 300 mm Tape Frame PI&C Task Force...
Member Press Release
RoodMicrotec enters into final settlement agreement with Robus regarding legal proceedings on perpetual bond
Deventer, February 18, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today announces that its wholly owned subsidiary RoodMicrotec GmbH has...
Member Press Release
Verific and DARPA Sign Partnership for Streamlined Access to Industry-Standard SystemVerilog EDA Software
Verific Design Automation today announced a partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to provide the DARPA community access to its electronic design...
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SPCC 2026 Bio Padraic O'Reilly
IR-PiFM: Molecular Detection and Identification of Nanoscale Surface ContaminationIntroduction: With continuous advances in semiconductor fabrication in branches such as high-NA/hyper-NA lithography...
Event
FEMC#28 Development, Scaling, and Transition of Novel Chemicals & Materials
Join us for this insightful Master Class with Larry Takiff, PhD, Co-Founder and CEO of Akita Innovations LLC, as he explores the path from lab-scale breakthroughs to scalable material solutions...
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MEMS & Sensors Technical Congress—MSTC 2025 Speaker Bio & Abstract - Matt Weimer
Replacement of PFAS Anti-Stiction Films in Inertial Sensors with Atomic Layer DepositionABSTRACT Stiction presents a significant challenge in the MEMS and sensor industry, restricting design...
Event
SiC—Silicon Carbide Webinar Series #3
Now Available On-Demand!
Join us online for the third webinar in the Silicon Carbide Series as we review the semiconductor technology of SiC and GaN bidrectional switches, analyze promising MBD...
Member Press Release
Legal proceedings initiated against RoodMicrotec GmbH regarding perpetual bond
Deventer, September 9, 2021 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, announces that it has been informed by Prime Capital Debt SCS, SICAV-FIS...
Blog
Zeroing in on EDA Tool Interoperability With Keysight EDA
The ESD Alliance member Keysight EDA, formerly Keysight EEsof, is part of Keysight Technologies, a $6 billion provider of design, emulation, and test solutions that accelerate innovation to connect...