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US Semiconductor Industry Incentive Proposals 2021 Bio - Peter Cleveland
Vice President of Global Government Affairs at the largest contract semiconductor company in the world. Direct policy, legislative, legal, regulatory, and standards matters. TSMC manufactures...
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US Semiconductor Industry Incentive Proposals 2021 Bio - Gene Irisari
Gene Irisari is Head of Semiconductor Policy for Samsung Electronics America, a U.S. subsidiary of Samsung Electronics Co. headquartered in South Korea. Based in Washington, D.C., Gene is responsible...
SEMI Press Release
SEMICON Europa, Messe München electronica 2022 Postponed One Week
BERLIN, Germany ─ May 6, 2021 ─ SEMICON Europa 2022, co-located with electronica, will be postponed one week to November 15-18, SEMI announced today. The move follows Messe Munich’s announcement that...
Member Company
Certain Micro Application Technology Inc.
Components of the wafer probe card, Ceramic micro-mechanical drilling, Stainless processing, Mockup making
Event
ATE North America TC Chapter Meeting
Automated Test Equipment (ATE) North America TC Chapter Meeting
Date: Tuesday, May 4
Time: 8:00 AM – 10:00 AM Pacific Time
Location: Online via Web Conference
AGENDA
(subject to...
Blog
Post COVID-19 Semiconductor Super Cycle – Demand for Legacy Equipment Grows
As we move through Q2 of 2021, it seems that the world is finally approaching normalcy. But I don’t believe our lives and businesses will ever be the same. Travel is unlikely to return to the same...
SEMI Press Release
Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports
MILPITAS, Calif. — May 3, 2021 — Worldwide silicon wafer area shipments increased 4% to 3,337 million square inches in the first quarter of 2021 compared to the fourth quarter of 2020, topping the...
Member Press Release
Gel-Pak Collaborates with BAE Systems on Innovative Packaging Solution for Thin Semiconductor Devices
HAYWARD, CA May 3, 2021: Gel-Pak, a division of Delphon and leading manufacturer of protective device carrier and film products for the semiconductor and optoelectronics industries announces its...
Member Press Release
Kenneth Hörhammer joins Picosun as Vice President, Sales
ESPOO, Finland, 29th of April 2021 – Picosun Group has appointed Kenneth Hörhammer as Vice President, Sales, and a member of Picosun Group’s Leadership Team as of May 1, 2021.
Kenneth Hörhammer has...
Event
Compound Semiconductor Materials Europe TC Chapter Meeting
Compound Semiconductor Materials Europe TC Chapter Meeting
Date: Thursday, April 29, 2021
Time: 04:30-06:30 PM CEST
via Web Conference
AGENDA
(subject to change)
Last updated:...