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SMC 2026 Speaker Bio - Prahalad Parthangal, PhD
Co-Engineering the AI Era: How Materials, Process and Equipment Innovations Converge in Advanced Packaging As AI systems scale in complexity and capability, their demands for bandwidth, power...
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HIGHLIGHTS OF THE 1Q 2020 EDITION OF THE WORLD FAB FORECAST REPORT
The Q1/February 2020 editions of the World Fab Forecast and World Fab Watch databases have been published and are available now. The following highlights are from our World...
Event
Flexible Electronics Master Class#2: AI in Mfg
This on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom...
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ESGS 2025 Abstract and Bio Tan Lu
Green ESMsABSTRACTDiscuss how Air Liquide Electronics Specialty Materials division contributes to sustainability.BIOGRAPHY COMING SOON
Event Presentation
BRINGING FUTURE VEHICLES TO MARKET FASTER
Xi Zhang from NXP discusses global automotive trends and the need for efficient automotive software development.
SEMICON China 2019 - Shanghai, China
Blog
Boosting Sensing for Autonomy in Agriculture
Jason Jelinek, a software technical manager at John Deere Electronics Solutions, has parlayed his more than two decades of embedded software engineering experience into commercializing controls and...
Blog
MEMS Fabrication: Growth Enabler or Industry Roadblock?
The MEMS industry has huge growth potential. Will MEMS fabrication act as a bottleneck to continued expansion or a critical conduit to achieving that potential? Slow development cycles, multiple...
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PV and PV Materials Japan TC Chapter Joint Meeting
SEMI® International Standards Program
PV and PV Materials Japan TC Chapter Joint Meeting
Tuesday, November 5, 2019 1:30 p.m. - 4:00 p.m.
SEMI Japan Tokyo Office, Tokyo,...