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Event
Flexible Hybrid Electronics Taiwan TC Chapter Meeting
FHE Taiwan TC Chapter meeting
Date:Wednesday Mar. 23, 2022
Time: 2:00-4:00 PM (Taiwan Time)
Online via Virtual Meeting
Agenda_FHE Taiwan TC Chapter...
Event
EMG Webinar Next Chapter in Moores Law Shift to Gate All Around Transistors
Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET). As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures...
Member Press Release
Linton Crystal Technologies Awarded Seed Lift and Rotating System Patent
Rochester, NY—Linton Crystal Technologies (LCT) has been awarded a U.S. Letters Patent for its Seed Lifting and Rotating System for Use in Crystal Growth. Patent 11,255,024 is the first of four...
SEMI Press Release
Global Fab Equipment Spending Expected to Hit New High of $107 Billion in 2022, SEMI Reports
Industry drive to expand and upgrade capacity to push spending over $100 billion for first time
MILPITAS, Calif. — March 22, 2022 — Global fab equipment spending for front-end...
Member Press Release
Picosun ALD demonstrates effective surface protection for materials in space conditions in ESA's tests.
ESPOO, Finland, 22nd of March 2022 – Picosun Atomic Layer Deposition (ALD) has been demonstrated to be a suitable solution for protection of surfaces exposed to atomic oxygen degradation in Low Earth...
Member Company
MITSUBOSHI DIAMOND INDUSTRIAL CO.,LTD.
SiCを中心とした化合物半導体のウエハをチップ化する装置と工具を販売しております。脆性材料の割断においては、88年の歴史がございます。その割断技術を使って、半導体分野に貢献致します。
Member Company
AQUSEN Technology Co., Ltd
Focus on process integration analysis and abnormal event detection by providing total solutions. Improve equipment property rate and process yield.
Member Company
SINTECH TECHNOLOGY CO., LTD.
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ISS 2022 Abstract & Bio - Sree Ramaswamy, United States Department of Commerce
BIOGRAPHY
Sree is a senior policy advisor to the US Secretary of Commerce. His expertise is in the areas of technology strategy, industrial competitiveness and supply...
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ISS 2022 Abstract & Bio - Ram S. Viswanath, Intel
Emerging Trends in Advanced Packaging of Semiconductors
ABSTRACT
With the insatiable demand to build high performance processors for the data center, advanced packaging is playing a central role in...
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ISS 2022 Abstract & Bio - Gene Irisari-Samsung Elrectonics America
Gene Irisari is Head of Semiconductor Policy for Samsung Electronics America, a U.S. subsidiary of Samsung Electronics Co. headquartered in South Korea. Based in Washington, D.C., Gene is responsible...
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ISS 2022 Abstract & Bio - Ian Staff-mySilicon Compass
BIOGRAPHY
Ian Paul Steff hails from the nexus of technology partnerships, innovation policy, investment attraction, economic development, and international trade. He...