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H.-S. Philip Wong is the Willard R. and Inez Kerr Bell Professor in the School of Engineering at Stanford University. He joined Stanford University as a Professor of Electrical Engineering in...

Dr. Gaurav Gupta is a Vice President Analyst at Gartner with the semiconductor and electronics team covering entire supply chain of chip manufacturing and design, including AI-based...

Mr. Perry joined ILS Technology as a director in March 2001 and was promoted to Vice President in January 2003. In June of 2010 Mr. Perry assumed the role of Product Line Manager for SecureWISE and...

Michelle Bourke received her B.Sc. degree in Optoelectronics and Laser Engineering from Heriot-Watt University in Scotland, UK. Subsequently she joined the Defence Evaluation and Research Agency...

Tingfang Ji joined Qualcomm in 2003 and is currently a senior director of engineering in Wireless R&D. From 2003 to 2014, he made instrumental technical contributions towards the development of...

PAUL BURLINGAME President and CEO Air Liquide Advanced Materials   Paul was appointed President & Chief Executive Officer of Air Liquide Advanced Materials in 2013 and is responsible for...

Table Stakes: Waterproofing is the New Must Have in MEMS & Sensors By 2020 there will be over 30 billion IoT devices, surpassing the human population by 5X, and growing to 75 billion by 2025....

High Loading Capacity Solvent Blend for a Safe and Efficient Alternative to NMP and Amine-Based Strippers Introduction:For photolithography processes, a wide variety of photoresists (PR) are...

While the concept of smart manufacturing is receiving increased attention in recent times, the SEMI Standards Program has for many years been developing the fundamental standards that enable today’s...

Secondary Equipment & Applications Standard Contract Elements Back to the: Secondary Equipment & Applications Technology Community Main Page Standard Contract Elements 1. DOCUMENT...