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John Strang 2024 Flex Workshop Abstract and Bio
Crossing the Chasm to CommercializationAbstractDermiSense seeks to disrupt the status quo by replacing expensive and resource-intensive blood sampling with an innovative low-cost, zero-power patch...
Event
Physical Interfaces & Carriers Japan TC Chapter Meeting
Physical Interfaces & Carriers Japan TC Chapter Meeting Date: Friday, April 12, 2024Time: 13:00-16:00[JST]by OVTCCM AGENDA Standards Contact Information:Hirofumi...
Member Company
ASCENDAS INNOVATION PTE. LTD.
"Ascendas is now CapitaLand, one of Asia's largest diversified real estate groups.
ASCENDAS INNOVATION PTE. LTD. is a Private Company Limited by Shares, incorporated on 1 February 2016...
Member Company
ADVANCED SEMICONDUCTOR EQUIPMENT TECHNOLOGY SINGAPORE PTE. LTD
Advanced Semiconductor Equipment Technology Singapore is a Singapore registered company that conduct sales, assembly and service of semiconductor equipment for the semiconductor manufacturing...
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Advanced Semiconductor Manufacturing Conference—ASMC 2024 Speaker Bio - Vijayalakshmi Seshachalam
BIOGRAPHY
Vijayalakshmi Seshachalam (Viji) works at GlobalFoundries, Malta as Process Engineering Manager for CVD Module under Advanced Module Engineering...
SEMI Press Release
SEMI Issues Statement on Change to U.S. CHIPS Act Notice of Funding Opportunity
MILPITAS, Calif. ─ April 11, 2024 ─ SEMI, the industry association serving the global electronics design and manufacturing supply chain, today issued the following statement from Ajit Manocha, SEMI...
Member Company
Lasertc Technology (Suzhou) Co., Ltd
打标机Marking Machine切割机cutting Machine钻孔机driller技术服务Technical service技术开发Technological development半导体专用设备制造Semiconductor special equipment manufacturing半导体专用设备销售Semiconductor special equipment...
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MEMS & Sensors Technical Congress—MSTC 2024 Speaker Bio - Christian Peters
BIOGRAPHYChristian Peters received the Dipl.-Ing. in Microsystem Technology in 2003 and the Dr.-Ing. degree from the Albert-Ludwigs-University, Freiburg, Germany, in 2009, both with highest...
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2024 Future of Electronics Abstract and Bios Dan Balder and Madhu Stemmermann
Advancements in Scalable Anisotropic Adhesive for FHE ManufacturingAbstractBuilding upon the foundation from the SEMI FlexTech supported Mixed Mode Interconnect (MMI) project, SunRay Scientific will...
SEMI Press Release
Global Semiconductor Equipment Billings Slip to $106.3 Billion in 2023, SEMI Reports
MILPITAS, Calif. – April 10, 2024 – Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to $106.3 billion in 2023 from an all-time record of $107.6 billion in 2022, SEMI,...
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David Kim
Liquid Metal Filled Fibers for Next Generation E-textilesAbstractGallium-based liquid metals have remarkable properties: melting points below room temperature, water-like viscosity, low-toxicity...