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SEMI Press Release
Lam Research Receives 2025 SEMI Award for North America
Company Selected for Innovation in Cryogenic Etch Technology for 3D NAND Device Manufacturing that Enables the AI EraPhoenix, Ariz. — October 7, 2025 — SEMI, the industry association...
SEMI Press Release
Electronic System Design Industry Reports Revenue of $3.8 Billion in Q3 2022, ESD Alliance Reports
MILPITAS, Calif. — January 23, 2023 — Electronic System Design (ESD) industry revenue increased 8.9% from $3,458.2 million in Q3 2021 to $3,767.4 million in Q3 2022, the ESD Alliance, a SEMI...
SEMI Press Release
SEMI Applauds Findings on Cybersecurity Hardware Adoption in Europe
BERLIN, Germany ─ March 15, 2022 – To strengthen cybersecurity for semiconductor manufacturing in Europe, the industry must unify behind security standards, support decision-makers in adopting...
Event
Atomic Layer Deposition (ALD) Solutions for MEMS and Actuators
Micro-electromechanical systems, or MEMS, constitute many devices that combine electrical and mechanical components, range in size from a few microns to millimeters, and are often fabricated using...
Member Company
Techgo Industrial Co., Ltd.
TECHGO is dedicated to providing comprehensive services for cooling tower and water treatment systems, including design consulting, installation and assembly, maintenance, and repair. In recent...
Member Company
Homwell Co., Ltd.
HOMWELL is the sales/service representative of: PILLAR: Pump/Teflon Valve/PFA Tube/Fitting. Greene Tweed: Chemraz O-Ring/Seal. WACOM: Mercury Vapor Lamp for Stepper/Mask Cleaner. ETS: Wet Bantch....
SEMI Press Release
ISS Europe to Spotlight Key Industry Workforce Development Issue
Qualified Workers Key to Europe’s Competitive Advantage in Global Supply Chain
DUBLIN ─ January 22, 2018 ─ SEMI today announced that SEMI Europe’s Industry Strategy Symposium (ISS Europe), coming on...
SEMI Press Release
2023 Energy Taiwan and Net-Zero Taiwan Opens This Week With Carbon Emission Reductions, Renewable Energy Innovations in Focus
TAIPEI, Taiwan — October 16, 2023 — 2023 Energy Taiwan and Net-Zero Taiwan opens Oct. 18 at the Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1) to showcase the latest...
Event
Arizona & Texas Virtual Fall Outlook
The SEMI Arizona & Texas Chapters PresentCreating an Ecosystem for Advanced Packaging: How Backend Manufacturing is Leading the Way
Event
Advanced Packaging and Material Characterization for Microelectronics (Webinar, US)
Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP,...
Page
Abstracts and Biographies
Laith Altimime, President, SEMI EuropeBiographyAs President of SEMI Europe, Laith Altimime leads SEMI’s activities in Europe and Middle East and North Africa (MENA). He has overall...
Blog
SEMICON Korea: New Technologies Power Chip Industry Paradigm Shift, Growth
The more than 53,000 people who flocked to SEMICON Korea last month were treated to a motherlode of insight into the future of the semiconductor industry as 470 companies exhibited innovative...