Showing 3061 - 3072 of 9066
Event
Advanced Packaging and Material Characterization for Microelectronics (Webinar, US)
Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP,...
SEMI Press Release
SEMI North America Advisory Board Welcomes New Member From Energetiq
MILPITAS, Calif. — February 6, 2025 — SEMI today announced the election of a new member to the SEMI North America Advisory Board (NAAB), Dr. Vikram Singh, Vice President and...
Event
SCIS Part Clean Program
This 2.5 hour webinar is offered OnDemand from the SEMI Library.
Blog
SMC Korea 2025 Highlights Cutting-Edge Materials Driving Next-Gen Chips Breakthroughs
Driven by the recovery of the overall semiconductor market and rising demand for advanced materials for high-performance computing (HPC) and high-bandwidth memory (HBM) manufacturing,...
Page
[PDS] Professional Development Seminar—University at Albany Speaker Bio - Eric Evans
BIOGRAPHYAfter graduating college, Eric Evans moved to Saratoga, where he currently lives with his wife and two children. He began his journey in this industry nearly 10 years ago at Tokyo Electron...
Member Company
MFC Sealing Technology Co., Ltd.
Established in 1974 and globally recognized in the sealing industry, MFC produces FFKM/FKM o-rings,center ring, slit valve door seal, membrane, lip seal, coating seal, spring seal and custom molded...
SEMI Press Release
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
MUNICH, Germany ─ May 1, 2025 ─ SEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany....
SEMI Press Release
SEMI 3D & Systems Summit to Spotlight Latest Trends in Heterogeneous Integration, Hybrid Bonding, Chiplet Design and Photonics
DRESDEN, Germany — April 4, 2023 — Leading experts in 3D integration and systems for semiconductor manufacturing will gather at the annual SEMI 3D & Systems Summit, June...
SEMI Press Release
SEMI Energy Collaborative Releases Recommendations for Expanding Low Carbon Energy in Taiwan
MILPITAS, Calif. – October 15, 2024 – SEMI, the global industry association representing the semiconductor and electronics design and manufacturing supply chain, today released a report by its Energy...
SEMI Press Release
METIS Issues Report Outlining Top Skills Needed by European Microelectronics Industry
BRUSSELS, Belgium — January 30, 2024 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today announced the publication of the final Yearly...
Event
Atomic Layer Deposition (ALD) Solutions for MEMS and Actuators
Micro-electromechanical systems, or MEMS, constitute many devices that combine electrical and mechanical components, range in size from a few microns to millimeters, and are often fabricated using...
Member Company
Techgo Industrial Co., Ltd.
TECHGO is dedicated to providing comprehensive services for cooling tower and water treatment systems, including design consulting, installation and assembly, maintenance, and repair. In recent...