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FOA Resources
Blog
Cloud Engineering Simulation: A Game Changer for Chip Designers
The microelectronics industry is entering the era of Cloud Engineering Simulation to slash the costs and risks of new technology development and speed time-to-market in spaces like semiconductors,...
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SE&A Charters and By-laws
SE&A Charters and By-laws
Back to the: Secondary Equipment & Applications Technology Community Main Page
CHARTER:
SECONDARY EQUIPMENT, SERVICES AND TECHNOLOGY GROUP
DRAFT –...
Blog
New SEMI Member D-SIMLAB Optimizes Semiconductor Manufacturing Decision-Making, Cuts Related Costs
D-SIMLAB Technologies, a Singapore-based provider of simulation-based business analytics and optimisation software solutions, recently joined SEMI. I spoke with Peter Lendermann, the company’s...
Blog
Silvaco Leverages Deep SOI Roots
As a leading TCAD provider, Silvaco has very deep SOI roots, reaching back over 20 years. When Oki* pioneered the first FD-SOI chips in 2000 (really? yes!), whose tools did they use? Silvaco's. And...
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MSEC 2024 Speaker Bio and Abstract - Michelle Bourke
Advancements in the Semiconductor Industry: A Journey from Transistors to AI ManufacturingABSTRACTThe semiconductor industry has evolved significantly since the invention of the transistor over 75...
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ISS 2023 Speaker Abstract & Bio - Lars Reger, NXP Semiconductors
The US and European Chips Act–How Far Will They Bring Us on the Road to Technology Sovereignty
ABSTRACT
Supply constraints and geopolitical shifts have put a spotlight on the semiconductor industry...
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ITPC 2020 - Omkaram Nalamasu Bio
Omkaram Nalamasu
Senior Vice President, Chief Technology Officer
Applied Materials
President, Applied Ventures, LLC
Dr. Omkaram (Om) Nalamasu is senior vice president and chief technology officer...
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SEMI Award for North America Nomination Guidelines
Award
The SEMI Award for North America is given to individuals and/or organizations that have produced an advancement of significant value to the progress of the semiconductor equipment technology...
Event
Advanced Packaging and Material Characterization for Microelectronics (Webinar, US)
Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP,...
Blog
China Surges Past Americas and Japan in IC Capacity
Back in 2012, China ranked fifth among seven regions worldwide in IC wafer capacity but surged past the Americas and Japan in 2018 and 2019 to claim the number three position (figure 1). That’s a big...
SEMI Press Release
COVID-19 Drives Rise in Global Fab Equipment Spending, SEMI Reports
MILPITAS, Calif. – September 8, 2020 – Soaring pandemic-fueled demand for chips that power everything from communications and IT infrastructures to personal computing, gaming and healthcare...