YAYATECH CO., LTD

YAYATECH has always upheld the business philosophy of creating first-class products and serving its first-class customers with first-class talents, taking part in the automatic optical inspection (AOI) industry. We have been through independent research and development, multinational collaboration and product development across different sectors. Since 2015, we have been actively developing advanced semiconductor packaging process inspection equipment to maintain a strong presence in the semi-conductor packaging and testing market with our micro crack and backside chipping inspection technology and AI artificial intelligence technology. YAYATECH’s unique micro crack inspection technology is leading the industry and has been widely applied to high-end packaging inspection after wafer dicing, system-level packaging carrier board inspection and IC micro crack inspection for automotive electronics and 5G products, all of which have been successfully introduced to the top 10 global packaging and testing companies for mass production with corresponding solutions.