TSI Incorporated

TSI® and MSP, a Division of TSI, address nanoscale challenges in semiconductor manufacturing, ensuring efficient, reliable processes that meet strict industry standards. TSI’s advanced tools detect contamination as small as 2 nm, safeguarding critical components and surfaces. Their particle detection technology measures 2 nm particles in high-purity process gases, while the TSI Nano LPM™ System monitors ultrapure water for nanoscale contaminants, maintaining process integrity and reducing defects. MSP’s vaporization technology enables consistent thin film deposition for processes like Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD), essential for microelectronic fabrication. Additionally, MSP provides traceable contamination standards for wafer and photomask inspection tool calibration, depositing particles as small as 10 nm to enhance accuracy. Together, TSI and MSP are trusted partners in advancing semiconductor manufacturing excellence.