Toray Engineering Co., Ltd.
Member Since
Jun 1, 2007
Member ID
4099
Website
Location
大江１－１－４５
大津市
520-2141
Japan
Primary Industry
Semiconductor
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Assembly/Packaging Equipment
Company Profile
Flip Chip Bonders, PLP Coater, Laser Micro Trimming Equipment (for Analogue IC, for Micro LED), Optical Semiconductor Wafer Inspection System, Slit-nozzle Coater for FPD, Titlers for FPD, FPD Inspection Equipment