Tescan

Tescan, A Shimadzu Company, delivers advanced electron microscopy and semiconductor failure analysis solutions for advanced packaging, process development, materials characterization and R&D. Our portfolio connects SEM, FIB-SEM, micro-CT, 4D-STEM, ultrafast laser processing with FemtoChisel and ex situ lift-out with EXLO into practical workflows that help engineers move from non-destructive 3D defect localization to rapid access, nanoscale cross-sectioning and root-cause analysis. For chiplets, TSVs, BGAs, hybrid bonding, wafer-level packaging and heterogeneous integration, Tescan reduces workflow fragmentation, protects sample integrity and shortens time-to-insight. Backed by Shimadzu’s analytical and measuring expertise and global support network, Tescan gives semiconductor labs a flexible, high-performance alternative for imaging, preparation and analysis, built around real customer workflows.