Shinko Seiki Co., Ltd.
Member Since
Jan 1, 1990
Member ID
15711
Website
Location
日本橋室町４－２－１６
楠和日本橋ビル ２Ｆ
中央区
103-0022
Japan
Primary Industry
Semiconductor
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Assembly/Packaging Equipment
Company Profile
Assembly/Hybrid Equipment: Automation & Robotics, Soldering & Brazing, Sealing, Molding Equipment, Furnaces: IR/Conveyor, Heating/Annealing. FLAT PANEL DISPLAY (FPD) - Assembly Equipment: Tape Automated Bonding, Liquid Crystal Injection, Lamination. FLAT PANEL DISPLAY (FPD) - Processing Equipment: Wet Etching/Stripping, Sputtering/Evaporation, Dry Etching/Stripping, Drying/Curing. Process Equipment: Physical Vapor Deposition, Ovens, Vacuum Pumps/Accessories, CVD, Automation & Robotics, Dry Etch Systems, Diffusion/Oxidation/Annealing.