SET Corporation S.A.

SET, Smart Equipment Technology, is a world leading supplier of high accuracy Flip-Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. Since 1975, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications. We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components. With Flip-Chip Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders. Ranging from manual loading to fully automated version, our Flip-Chip Bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.