Plum Five Co., Ltd.
Member Since
May 1, 2007
Member ID
153329
Website
Location
荏田町311-3
横浜市青葉区
225-0013
Japan
Primary Industry
Semiconductor
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Assembly/Packaging Equipment
Company Profile
Wafer Level CSP and Leadless Package (QFN etc.) which were done a dicing process.Even if devices are on the film frame.Can be testing multi device at high speed in the same time.It is the epoch-making probing handler which advantage of probe system with the position compensation function.This is our original technology.