NIDEC MACHINE TOOL CORPORATION

Nidec Machine Tool Room-temperature Wafer Bonder "BOND MEISTER" The room-temperature bonding technique, which holds bonding materials (wafers) together by activating their surfaces in a vacuum, can provide strong bonding without applying heat. The use of room-temperature bonding has primarily been used in the field of sealed packaging for MEMS (Micro Electro Mechanical Systems), but because this technique can be applied to diverse materials, it has recently been used in fields other than MEMS, such as light-emitting and radio-frequency (RF) devices. Nidec Machine Tool has released a line of room-temperature bonders applicable to different wafer sizes for various purposes, ranging from research and development (R&D) to device mass production. The company is also trying to expand the application fields of room-temperature bonding by providing various kinds of bonding support services.