NIDEC ADVANCE TECHNOLOGY CORPORATION

Nidec Advance Technology Corporation has dedicated to deliver electrical inspection systems for PWB and Semiconductor package industry. Applying the established technologies, Nidec Advance technology also develops semiconductor inspection systems. Our primary products, RWi series are Semiconductor Wafer Bump 2D/3D Inspection System which is realized fully integrated simultaneous 2D/3D & High-Speed Scanning to measure Gold, Solder μ and Cu Pillar Bumps. MEMS spring probe manufacturing line will also become a good solution for Probe Card Application. Recently, we relased the inspection system solution for power devices such as IGBT and SiC. Please feel free to contact and find our solutions.