Nanotec International GmbH
Member Since
Apr 26, 2023
Member ID
154405
Website
Location
Kreuzhofstrasse 10
Munich
D-81476
Germany
Primary Industry
Semiconductor
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Assembly/Packaging Equipment
Company Profile
nanotec international provides solutions for semiconductor backend, assembly/packaging and related fields to the European market since more than 20 years.
Together with our strong partners from Asia, the USA and Europe, we can supply equipment and materials for various processes: Wafer Bonding, Flip Chip, Solder Ball and Cu Pillar Placing, Reflow, Sawing & Placement, Laser Marking, Laser Cutting, LED Sorting, Pick & Place Sorting, Void-Free Curing/Soldering, 2D/3D AOI and Vision Inspection, Plasma Cleaning and many more.
Our trained field service engineers, based all over Europe, are ready to assist on technical requests within a short time.
Please contact us anytime to discuss your challenges and learn about the solutions and our new process products we can offer you.