MUSASHI ENGINEERING,INC.
Member Since
Jan 1, 1988
Member ID
1048
Location
下連雀８－７－４
三鷹市
181-0013
Japan
Primary Industry
Semiconductor
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Material Handling
Company Profile
Assembly/Hybrid Equipment: Precision dispenser, Die Bonding, Automation & Robotics, Sealing, Molding Equipment. Assembly/Hybrid Materials: Substrates, Marking Inks, Bonding Tools. Process Chemicals: Photoresist, Solvents.