Macdermid Performance Solutions Japan KK
Member Since
Mar 31, 2026
Member ID
2719190
Website
Location
東豊田４８０－２８
平塚市
254-0082
Japan
Company Profile
Optimize Next-Gen Technologies with Advanced Packaging Solutions
Innovative processes for Redistribution Layer (RDL), copper pillars, and solder bumps that optimize thermal, electrical, and structural performance in future technologies.