LIDROTEC GmbH
Member Since
Jan 27, 2023
Member ID
1154787
Website
Location
Lothringer Allee 2
EEZ
Bochum
44805
Germany
Primary Industry
Semiconductor
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Other
Company Profile
LIDROTEC stands for quality, innovation and precision. We build wafer dicing laser machines to cut microchips for the semiconductor industry. Our technology reduces the material waste rate in the cutting process to virtually 0% (current waste rate is up to 10%). Our unique innovation is the use of liquids to cool and rinse the wafers while they are cut with the laser. Semiconductor manufacturers that use our cutting-edge technology will save costs and increase productivity.