KIYOKAWA PLATING INDUSTRY CO.,LTD

High-Precision Semiconductor Plating Solutions We offer electroplating for micro-bumps and fine wiring on 6–12 inch wafers, providing a complete process from sputtering to seed removal. Our solutions support miniaturization and high-performance packaging, from prototyping to mass production. Our electroless UBM plating ensures reliable bonding for Si, SiC, and GaN. Backed by automotive semiconductor expertise, we provide stable, high-quality plating for various applications. We also provide TSV/TGV copper fill plating for 2.5D/3D packaging, enhancing chiplet integration and energy efficiency. Blind and through vias are supported.