JTEKT MACHINE SYSTEMS CORPORATION

High-precision mirror-finish grinding machine that can replace lapping machines, intergating the three processes of the wafer production line (lapping + one side grinding + the other side grinding) into one machine. ・Simultaneous double-sided grinding enables traceability of grinding data for each wafer. ・OHT (Overhead Hoist Transfer) is available for wafer transfer. ・Sutiable for grinding hard and brittle materials such as power semiconductors and also materials with crystal orientation like sapphire too.