HPSP LTD.
Member Since
Mar 25, 2021
Member ID
1043525
Website
Location
26, Samsung 1-ro 1-gil
Hwaseong-si
Gyeonggi-do
18449
Korea (the Republic of)
Primary Industry
Semiconductor
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Deposition
Company Profile
HPSP, a trusted partner of the world’s leading semiconductor companies, is at the heart of the silicon roadmap. In fact, almost all advanced chips today are made with HPSP technology.
HPSP develops, markets, manufactures, and services a proprietary High Pressure Anneal Process (HPAP) system that combines the benefits of traditional batch furnace and high pressure (up to 25ATM) processing capabilities in various ambience.
With HPAP, thermal budget can be lowered to improve performance for 14nm & beyond devices – Logic (Si, SiGe, III-V), Memory (3D NAND) & CIS.
HPSP product, GENI-SYS, enables applications from HPA to wet oxidation for various devices.