HiSOL, Inc.
Member Since
Jan 1, 1982
Member ID
6290
Website
Location
上野1-17-6
台東区
110-0005
Japan
Primary Industry
Semiconductor
Primary Product Category
Services
Primary Product Sub Category
Distributor, Manufacturing Representative
Company Profile
Analysis/Measurement: Microscopes, Probe Stations/Materials, X-ray. Assembly/Hybrid Equipment: Burn-In, Die Bonding, Die Sorter, Flip Chip, Inspection, Pick and Place, Sealing, Vision Systems, Wire Bonding, Plasma Cleaner. Assembly/Hybrid Materials: Bonding Tools, Bonding Wire, Die Attach Compounds, Packages - Ceramic. Test: Environment Chambers, Failure Analysis, Handlers/Positioners, Probers.