Hanwha Semitech Co.,Ltd

Hanwha Semitech is a pioneer in manufacturing solution from Korea. We challenge ourselves to thrive further to build better products. Hanwha started equipment business as Korea's 1st SMT chip mounter maker in 1989. With this experience, we started R&D for semiconductor back-end equipment from 1993. We developed, built and successfully introduced our own back-end manufacturing machines: Wire Bonder (1996), Flip Chip Bonder (2009), Die Bonder (2020), TC Bonder (2025) and Hybrid Bonder (Proto 2022). We acquired deposition equipment technology by acquiring the front-end equipment business in 2024. By doing so, we have become one of few who has in-house solution for both Front to Back-End in semiconductor manufacturing. Our clients vary from global IDM to OSAT, and it is a proof that our equipment is validated its quality in the market. We will continue to move forward, along with our customers. We are “Advanced Manufacturing Solution Creator.”