Grintimate Precision Industry Co., Ltd.

Grintimate specializes in the development and manufacturing of high-precision grinding and thinning equipment, offering reliable solutions for processing hard and brittle materials. We are the first company in Taiwan to develop an MIT (Made-in-Taiwan) grinding machine capable of thinning 12-inch silicon carbide (SiC) wafers with a total thickness variation (TTV) of less than 2 µm. Whether you are processing silicon, SiC, quartz, glass, sapphire, ceramics, PCBs, wafers, or ingots — for substrate thinning or backside grinding — Grintimate provides versatile equipment configurations tailored to your specific process requirements.

全鑫精密專注於高精度研磨與減薄設備的研發與製造，致力於提供硬脆材料的專業研磨解決方案。我們是全台首創可研磨並減薄 12 吋 SiC 晶圓、達成 TTV < 2 µm 的國產設備製造商。 無論加工材料為矽（Silicon）、碳化矽（SiC）、石英、玻璃、藍寶石、陶瓷、PCB，或晶圓、晶錠等，全鑫皆能依據客戶的製程需求，提供多元靈活的設備配置，滿足從基板減薄到晶背研磨的各種應用。 GTR Series – 4 to 12-In