Grand Process Technology Corporation

Grand Process Technology is the nation's leading brand in the semiconductor wet processing equipment industry, founded in 1993. We have branches throughout Taiwan from the North, Central and Southern areas.We were listed on the TSE in 2011 and we are very well known in the technology industry for manufacturing metal etching equipment and 8/12 inch single wafer cleaning equipment. Grand Process Technology has a very strong development and design team.We possess more than hundred manufacturing process patents,collaborating with Japan,Germany and other countries.From designing and development,automatic system customization,assembly,testing and product initialization to after-sales servicewe provide rapid response to your needs and elevate our quality control.We are committed to handling all your wet processing manufacturing. In addition,Grand Process Technology has invested millions in a top of the line clean room laboratory.We invest tremendous resources to specialize in innovative developments.We have always had a firm grasp on foreseeing the trends within our field and this enables us to gain trust and orders from our clients. With 30 years of experience,Grand ProcessTechnology is a trust worthy partner.We plan to combine high quality with comprehensive technical service and a(more...)

Founded in 1993, HongSo Group is a leading Taiwanese technology group specializing in semiconductor process equipment, process chemicals, precision engineering, and integrated solutions for advanced manufacturing. With its flagship company GPTC (Grand Process Technology Corp.), the group has built a strong reputation in wet-process equipment for semiconductor wafer-level packaging processes. Over the years, HongSo has expanded its portfolio through strategic investments and subsidiaries in areas such as automation systems, precision plastics, engineering software, and inspection technology such as X-ray、UVVIS、NIR and IR. Key affiliates include Chemleader Corporation (semiconductor process chemicals), Challentech International Corporation (equipment distribution and metrology), and TYNE systems (yield enhancement data analysis system). In recent years, HongSo has adopted a solution-oriented approach, helping clients optimize complex processes such as hybrid bonding, wafer-level packagin