FusionAP Sdn. Bhd.
Member Since
Mar 16, 2026
Member ID
2720365
Website
Location
02-05, NCER Technology Innovation Centre (NTIC), Plot 36, Hilir Sungai Keluang 2,
Bayan Lepas Industrial Park, Phase 4,
Bayan Lepas
Penang
11900
Malaysia
Primary Industry
Semiconductor
Primary Product Category
Device Manufacturing
Company Profile
FusionAP is a Malaysia-based advanced semiconductor packaging company dedicated to pioneering next-generation technology development. Founded in 2025, the company collaborates closely with Integrated Circuit (IC) designers and wafer fabrication players to deliver cutting-edge 2.5D, 3D and beyond advanced packaging solutions.