FusionAP Sdn. Bhd.
Member Since
Mar 16, 2026
Member ID
2720365
Website
Location
Suite 163E, Level 16, Hunza Tower Gurney Paragon,
Jalan Kelawei,
Georgetown
07
10250
Malaysia
Primary Industry
Semiconductor
Primary Product Category
Device Manufacturing
Company Profile
FusionAP is a Malaysia-based advanced semiconductor packaging company dedicated to pioneering next-generation technology development. Founded in 2025, the company collaborates closely with Integrated Circuit (IC) designers and wafer fabrication players to deliver cutting-edge 2.5D, 3D and beyond advanced packaging solutions.