Fasford Technology Co.,Ltd.
Member Since
Sep 14, 2015
Member ID
267494
Website
Location
下今諏訪610-5
南アルプス市
400-0212
Japan
Primary Industry
Semiconductor
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Assembly/Packaging Equipment
Company Profile
Die bonder products from Fasford Technology come in two series.The SiP Bonder DB series for flash memory and logic devicies and the SiP Mounter CM series for high-speed DRAM for computers.