Engis Corporation

Engis® is recognized globally as a leader of precision surface finishing systems for lapping/polishing of compound semiconductors and advanced materials. Utilizing our diamond processing expertise, we offer engineered slurries, compounds, lubricants, composite plates and pads tailored to substrate requirements. Together with our robust lapping/polishing machine design and state-of-the-art process development laboratories, Engis provides complete solutions for high-quality, high-yield wafer processing.