Boschman advanced packaging technology

Boschman Technologies is a market leader in Pressure Sintering and Advanced Transfer Molding, offering both development services and industrial equipment. We provide a one-stop-shop for innovative packaging solutions, from concept to industrialization, ensuring efficient and effective packaging with a short time-to-market. Boschman specializes in advanced transfer molding and sintering systems for electronic assembly industries, offering technologies like Ag-Sintering, Film Assisted Molding (FAM), Dynamic Insert Technology (DIT), and Through Polymer Via (TPV). Their applications span various industries, including automotive, medical, avionics, mobile, industrial, and renewables. Their package development process includes conceptualization, design, prototyping, and sampling, ensuring high yield production and compliance with ISO-9001-2015 standards. Boschman also offers low to medium volume assembly services, leveraging over 30 years of experience in advanced packaging solutions.