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SEMI Press Release
Q2 2023 Global Semiconductor Equipment Billings Dips 2% Year-Over-Year, SEMI Reports
MILPITAS, Calif. – September 6, 2023 – Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in the second quarter of 2023, while quarter-over-quarter billings...
Member Press Release
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high...
SEMI Press Release
SEMICON Taiwan 2023 Kicks Off With Press Conference Spotlighting Critical Semiconductor Industry Themes
TAIPEI, Taiwan – September 5, 2023 – Industry luminaries gathered today for a press conference to kick off SEMICON Taiwan 2023, opening tomorrow with companies from across the electronics...
Member Press Release
Sikama International Announces Full Commercialization of Acid-Free “Electron Attachment” Fluxless Solder Reflow System
SANTA BARBARA, CA – September 1, 2023 – Sikama International Inc., in collaboration with AirProducts Inc.™, is proud to announce the full commercial launch of its acid-free Electron Attachment (EA)...
SEMI Press Release
Dr. Lawrence T. Pileggi of Carnegie Mellon University to be Honored With 2023 Phil Kaufman Award
Dr. Pileggi Will be Recognized for His Significant Contributions to the Electronic System Design Industry
MILPITAS, Calif. – September 5, 2023 – Dr. Lawrence Pileggi, Coraluppi Head...
SEMI Press Release
SEMI to License Server Certification Protocol to Help Combat Software Piracy
MILPITAS, Calif. ─ September 5, 2023 ─ SEMI today announced that, starting in Q3 2023, it will license its server certification protocol to combat software piracy. With...
SEMI Press Release
SEMICON Europa 2023 Conferences to Highlight Advanced Packaging and Fab Management as Key Enablers of Sustainability
MUNICH, Germany ─ September 5, 2023 ─ Experts will gather for insights into the latest advanced packaging and fab management trends and innovations as critical enablers of the path to net...
SEMI Press Release
SEMI SOI Industry Consortium Elects New Leadership and Governing Council and Announces Upcoming Events
MILPITAS, Calif. — October 30, 2023 — SOI Industry Consortium (SOIIC), a SEMI Technology Community, today announced new leadership, Governing Council members and upcoming educational events...
Member Press Release
Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023
Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023
Innovative bonding materials presented at leading Asia technology...
Blog
Chip Industry Fun Facts – Great Pyramid, Microscopic Devices, Eyeing the Roadway and Sand!
Did you know that a single semiconductor chip has as many transistors as all the stones in the Great Pyramid of Giza? Just how many stone blocks did it take to build the iconic ancient Egyptian...
SEMI Press Release
SEMI Korea Summit to Showcase Future of Advanced Packaging
SEOUL, Korea — August 29, 2023 — With advanced packaging a key enabler of semiconductor innovation, the stage is set for the Advanced Packaging Summit as industry leaders and...
SEMI Press Release
Vietnam Business Summit 2023: Paving the Way for Vietnam's Semiconductor Industry Growth
HANOI, Vietnam — 29 August 2023 — Key semiconductor industry players and stakeholders including partners, government agencies, and academia will gather September 28-29 in Hanoi for...