Showing 2185-2196 of 2576
Event Presentation
Packaging Solutions for 3D Active Sensing Devices
A representative from China Wafer Level CSP Co., Ltd. discusses 3D sensing technologies and their packaging solutions.
SEMI China Members Day 2019 - Shenyang, China
Event Presentation
The impact of semiconductor genetics on our industry
He Xinyu, from Beijing IC Manufacturing and Equipment Equity Investment Fund, discusses the role that semiconductor genetics can play in the electronics manufacturing industry and the unique...
Event Presentation
Is semiconductor still a cyclical industry?
Billy Feng provides an investors perspective on the "Super Cycle" and whether the semiconductor industry is still a cyclical industry.
SEMI China Members Day 2019 - Shenyang,...
SEMI Press Release
First Quarter 2019 Worldwide Semiconductor Equipment Billings Drop 19 Percent Year-Over-Year
MILPITAS, Calif. — June 3, 2019 — SEMI, the global industry association representing the electronics manufacturing and design supply chain, today reported that worldwide semiconductor manufacturing...
Blog
SOI Consortium & Ecosystem Shines at SOI Academy (Shanghai) & WCS (Nanjing)
The SOI Consortium and member companies had a significant presence at two important events in China recently: the World Semiconductor Congress (WCS) in Nanjing and the SOI Academy, including an...
Webinar Replay
MEMS: A World of Opportunities
The webinar will cover KPMG’s current view of the Semiconductor sector and highlight results from our recently released Semiconductor Executive Outlook for 2019 as well as provide an overview of the...
Member Press Release
Picosun strengthens its presence in the healthcare industries
ESPOO, Finland, 29th May 2019 – Picosun Group, the global provider of AGILE ALD™ (Atomic Layer Deposition) thin film coating solutions, continues its breakthrough into healthcare industries by...
Blog
SEMI Spring Washington Forum – Connecting Members with Policymakers at a Critical Time
Tensions between the United States and China have reached fever pitch. Ongoing trade negotiations between the U.S. and China broke down earlier this month over reported backpedaling by China on key...
SEMI Press Release
Audi First Carmaker to Join SEMI; Membership to Advance Automotive Electronics
MILPITAS, Calif. – May 28, 2019 – SEMI, the industry association serving the global electronics manufacturing and design supply chain, announced today that AUDI AG, a leading German manufacturer of...
SEMI Press Release
FLEX Taiwan 2019 Opens Tomorrow – Flexible Hybrid Electronics Innovations, Opportunities, Growth in Spotlight
FLEX Taiwan 2019 Opens Tomorrow – Flexible Hybrid Electronics Innovations, Opportunities, Growth in Spotlight
Hsinchu, Taiwan — May 28, 2019 — The latest trends and opportunities in flexible hybrid...
Event Presentation
12" Wafer Production
A representative from Nexchip discusses 12" wafer production.
EMC China 2019 - Shanghai, China
Event Presentation
Artificial Intelligence News Briefing
Xie Xinzhen, General Manager of Keda Xunfei (iFLYTEK), gives a briefing on Artificial Intelligence.
EMC China 2019 - Shanghai, China