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Blog
Free One-Day Virtual Event – Designing Digital and Analog IP Using Freely Available Resources
Every Friday I try to clear out my inbox. It’s a small way to feel like I’m on track with all the different projects we have going on at the SEMI Foundation. As I’m doing that, it’s rare that I’ll...
Blog
IoT Powers Connections at Infineon Backend Manufacturing Singapore Plant to Drive New Efficiencies
Teck Khiong, WOI, senior manager of Factory Integration at Infineon Technologies Asia Pacific Pte Ltd, recently shared with me how the Infineon backend plant in Singapore has benefited from its...
Blog
Mid-Year End Market Recovery Plus Continued Autumn Semiconductor Strength
Although the semiconductor chip and capital equipment markets performed well in the first half of 2020, many of the electronic equipment end markets struggled globally. World electronic equipment...
Blog
FLEX 2021: Making the World Safer – Call for Abstracts Now Open!
Is your company working on the next big thing in flexible, hybrid and printed electronics – a breakthrough or innovation that will make the world safer, healthier or more productive for years to...
Blog
Highlights from SEMI’s Smart MedTech Webinar Series
If you bought a new car recently, you must have noticed that it warns you if one of its functions needs your attention. It even alerts the factory if repairs or major adjustments are needed. Wouldn’t...
SEMI Press Release
SEMICON Taiwan 2020 Hybrid to Lead the Way in AI and 5G Era
HSINCHU, Taiwan – September 10, 2020 – Advanced, smart and green manufacturing will take center stage on-site and online September 23-25 as SEMICON Taiwan 2020 gathers industry visionaries and...
Member Press Release
ClassOne’s Solstice LT Plating System Selected by Jenoptik for Producing High-Power Diode Lasers
Kalispell, MT – Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice® LT electroplating system to Jenoptik for manufacturing semiconductor material for...
Member Press Release
MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5...
SEMI Press Release
COVID-19 Drives Rise in Global Fab Equipment Spending, SEMI Reports
MILPITAS, Calif. – September 8, 2020 – Soaring pandemic-fueled demand for chips that power everything from communications and IT infrastructures to personal computing, gaming and healthcare...
SEMI Press Release
Second Quarter 2020 Global Semiconductor Equipment Billings Up 26% Year-Over-Year, SEMI Reports
MILPITAS, Calif. – September 8, 2020 – Second quarter 2020 global billings for semiconductor manufacturing equipment jumped 26% year-over-year and 8%, to US$16.8 billion, from the first quarter of...
Blog
Industry 4.0 in Practice – Micron Lights the Way in Virtual ‘Go and See’ of Singapore Manufacturing Plant
Making Strides TogetherKnowledge is power – especially when it is shared. This principle formed the foundation for Micron’s Go and See virtual visit of its Singapore manufacturing plant on 26 August...