Showing 1465-1476 of 2598
SEMI Press Release
First Quarter 2021 Global Semiconductor Equipment Billings Increase 51% Year-Over-Year, SEMI Reports
MILPITAS, Calif. – June 2, 2021 – Global semiconductor equipment billings increased 51% year-over-year and 21% from the prior quarter to US$23.6 billion, SEMI announced today in...
SEMI Press Release
North American Semiconductor Equipment Industry Posts April 2021 Billings, Logs Fifth Consecutive Month of Record Growth
MILPITAS, Calif. — May 24, 2021 — North America-based semiconductor equipment manufacturers posted $3.41 billion in billings worldwide in April 2021 (three-month average basis), according...
Blog
Breaking Down Chip Design Functional Verification with Breker’s Adnan Hamid
Adnan Hamid, CEO, founder and visionary of Breker Verification Systems, an ESD Alliance member based in San Jose, Calif., once described his job in chip design verification at AMD as “breaking...
Member Press Release
Brooks Instrument: 75 Years in Fluid Measurement and Control
Brooks Instrument is celebrating its 75th year providing high-precision fluid measurement and control instrumentation. A world leader in advanced flow, pressure and vapor delivery solutions, the...
Member Press Release
ESD Alliance Names 10-Member Governing Council to Two-Year Term
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, today welcomed back nine members of its Governing Council along with newly elected member Aki Fujimura, D2S’ CEO.
Simon...
Member Press Release
3D-Micromac eliminates critical process bottlenecks to microLED display manufacturing with new laser micromachining platform
microCETI™ supports all laser processes in microLED display manufacturing with up to several orders of magnitude higher transfer rates; multiple system orders already received
Chemnitz, Germany, May...
SEMI Press Release
Global 200mm Fab Capacity on Pace to Record Growth to Meet Surging Demand and Address Chip Shortage, SEMI Reports
MILPITAS, Calif. — May 25, 2021 — Semiconductor manufacturers worldwide are on track to boost 200mm fab capacity by 950,000 wafers, or 17%, from 2020 through 2024 to reach a record high of...
Member Press Release
PICOSUN® Sprinter demonstrates record-breaking batch film quality
ESPOO, Finland, 19th of May 2021 – Picosun Group has further optimized its PICOSUN® Sprinter ALD system processes successfully for semiconductor, display and IoT component manufacturing...
Member Press Release
QEI Partners with Odyssey Technical Solutions for Repair Services of Semiconductor Products
Round Rock, Texas – May 19, 2021 – Odyssey Technical Solutions, world leader in RF, DC, and microwave repairs, is pleased to announce it has been selected as partners for repair services of all QEI...
Blog
2021 Women in Semiconductors: Leadership, Self-Care, and Trusting Your Employees in the Age of COVID-19
“The most important work you can do in the coming year is to start engaging allies.” This is how Dr. Joanne Kamens, Executive Director of Addgene, began her keynote at this year’s Women in...
Blog
Throwing a Curveball: Will Future ICs Be Designed Using Curvilinear Shapes Instead of Rectangles?
A change is underway in the manufacturing sector as the use of curvilinear shapes on photomasks grows, leading to the real possibility of curvilinear shapes in designs. It may just be the start of a...
Member Press Release
Linton Expands in China, Offers Increased Capacity Just Eight Years After Acquiring Kayex
Rochester, N.Y.—May 13, 2021—Dalian Linton NC Machine Co. Ltd. has opened a more than 70,000 square meter research and design center and manufacturing base in Xishan, Wuxi, China. This comes just...