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Blog
The Challenge Doesn’t Stop at Certification: Post-B Corp Certification Reflections
Nearly one year after becoming the semiconductor industry’s first Certified B CorporationTM by meeting the highest standards of social and environmental responsibility, Brewer Science still finds...
SEMI Press Release
Worldwide Semiconductor Assembly and Test Facility Database Now Tracks Integrated Device Manufacturers, 475 Facilities
New edition of SEMI and TechSearch International database encapsulates global footprint of key semiconductor industry segment
MILPITAS, Calif. – February 23, 2022 – SEMI and TechSearch...
Member Press Release
Rapid Silicon Chooses Verific’s Industry-Standard Parser Platform
Verific Design Automation, the leading provider of SystemVerilog, Verilog, VHDL and UPF Parser Platforms, today announced Rapid Silicon, a provider of AI-enabled application-specific FPGAs based on...
Member Press Release
RoodMicrotec enters into final settlement agreement with Robus regarding legal proceedings on perpetual bond
Deventer, February 18, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today announces that its wholly owned subsidiary RoodMicrotec GmbH has...
Member Press Release
Picosun delivers powder MEMS technology platform to Fraunhofer ISIT
ESPOO, Finland, 17th of February 2022 – Fraunhofer Institute for Silicon Technology (ISIT) has taken PICOSUN® P-300B ALD system into use as their powder MEMS technology platform.
Fraunhofer ISIT...
Blog
House Passes CHIPS Funding; Conference with Senate Last Remaining Legislative Hurdle
On February 4, the U.S. House of Representatives passed the America Creating Opportunities for Manufacturing, Pre-Eminence in Technology, and Economic Strength (COMPETES) Act by a vote of 222-210....
SEMI Press Release
MSTC 2022 to Showcase Latest MEMS and Sensors Advances Driving Medical and Mobility Innovations
MILPITAS, Calif. ─ February 16, 2021 – Advances driving the next generation of medical and mobility applications will take center stage at the SEMI MEMS and Sensors Technical Congress (MSTC...
Blog
3D-IC: Great Opportunities, Great Challenges
The growing adoption of 2.5D and 3D integrated circuits (3D-ICs) marks a major inflection point in the world of semiconductor design. Electronic designers demand greater integration densities and...
Member Press Release
Beneq unveils two new ALD products for 300mm and compound semiconductor device fabrication respectively
BENEQ, PRESS RELEASE, December 6, 2021
Beneq revolutionized ALD cluster tools for More-than-Moore device makers with the highly successful Beneq Transform® family of products. Today, Beneq broadens...
Member Press Release
YES Establishes Engineering, Design and Sales Presence in India; Ankineedu Velaga to Lead YES India as Country Head and Managing Director
FREMONT, Calif. - YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today...
SEMI Press Release
SEMI Applauds the Release of the European Chips Act
BRUSSELS, Belgium ─ February 08, 2022 – SEMI, the global industry association representing the electronics manufacturing and design supply chain, today applauded the publication of the European Chips...
Blog
Equitable Hiring In a Talent Shortage
With investments in the hundreds of billions of dollars announced in the United States, the semiconductor industry is entering an unprecedented growth phase. We are only beginning to understand the...