Showing 1225-1236 of 2576
Member Press Release
RoodMicrotec reports preliminary total income of EUR 14.5 million for 2021
• Preliminary total income for 2021 of EUR 14.5 million exceeds the outlook
• Highest total income since 2011 showing an excellent recovery over last year
• Persistently improved cash...
SEMI Press Release
SEMI Applauds House Introduction of America Competes Act of 2022 with Funding for CHIPS Act
MILPITAS, Calif. – January 25, 2022 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the introduction of the America...
SEMI Press Release
North American Semiconductor Equipment Industry Posts December 2021 Billings
MILPITAS, Calif. — January 25, 2022 — North America-based semiconductor equipment manufacturers posted $3.92 billion in billings worldwide in December 2021 (three-month moving average...
Member Press Release
NucleiSys Adopts Breker’s System Coherency TrekApp
Breker Verification Systems today announced Nuclei System Technology deployed its System Coherency Synthesis TrekApp to ensure coherency of its configurable low-power and high-performance 32- and...
SEMI Press Release
SEMI Industry Strategy Symposium Europe to Spotlight Environmental Sustainability, Social Responsibility and Supply Chain Resilience
BRUSSELS, Belgium ─ January 25, 2022 ─ SEMI announced today the return of the Industry Strategy Symposium Europe (ISS Europe) 2022 as an in-person event to Brussels, Belgium,...
Blog
Conquering 2.5D and 3D Chip Design Challenges with Monozukuri
Monozukuri of Rome, Italy, one of the newest members to join the ESD Alliance, a SEMI Technology Community, is out to conquer 2.5D and 3D design challenges for next-generation electronic products by...
Member Press Release
Samco Unveils New Plasma Etching Cluster Tool for Compound Semiconductor Device Fabrication
Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, is proud to introduce the new...
Member Press Release
Elevate® Celebrates 10 Years of Accomplishments in Fabrication and Packaging Technology (2012-2022)
Launched a decade ago, Technic’s specialized line of semiconductor deposition chemistry marketed under the name Elevate has become one of the most recognized brands in semiconductor fabrication and...
Blog
Open Source EDA, IP, Cloud-Based Design, Extending Moore’s Law: Pedestal Research’s Laurie Balch Talks Chip Design Trends
As a leading analyst covering the electronic system design segment, Laurie Balch is well steeped in identifying and analyzing technology trends and forecasting new market opportunities. She’s also a...
Member Press Release
Picosun part of extensive quantum technology development project
ESPOO, Finland, 18th of January 2022 – Picosun takes part as an industrial partner in QuTI, a recently launched extensive research project aiming to develop new components, manufacturing and testing...
SEMI Press Release
SEMICON Korea 2022 Hybrid To Highlight Talent, Sustainability, Smart Manufacturing and Chip Industry Growth Drivers
SEOUL, South Korea — January 18, 2022 — With the global semiconductor supply chain rapidly evolving to meet the increasing demands of digital transformation, the stage is set for SEMICON Korea 2022...
Member Press Release
Victor Huang Joins Yield Engineering Systems (YES) as VP of Legal Affairs
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Victor...