Wuhan HGLaser Engineering Co., Ltd

LDU 6 UV Wafer Cutting System researched by HGLaser is with international advanced level.It is adopted with UV cold laser source, with small heat affected zone and scribing quality. This system is applied in cutting semiconductor wafer product, such as single, double mesa passivation diode wafer, single & double mesawafer and IC wafer etc.

华工激光是中国激光工业化应用的开创者、引领者，全球领先的激光装备及智能创造方案提供商，国内知名高科技上市公司华工科技核心子公司，是国家重点高科技企业、激光行业国际标准制定参与单位、国家标准制定的牵头组织和承担单位。公司全面布局激光智能装备、量测及自动化产线、智慧工厂建设、为智能制造提供整体解决方案。