Suzhou Xinhe Semiconductor Material Co.,Ltd

Suzhou Xinhe Semiconductor material is mainly engaged in the R&D and manufacturing of semiconductor chip bonding materials, namely capillary, capillary are widely used in semiconductor IC packaging and LED packaging. It is the core material of chip packaging and bonding process. The compant is focus on ceramic capillary for mid-to-high-end market research and manufacturing. In ceramic raw material preparation, molding process, surface treatment, equipment research and development and other aspects of the core technology completely independent and realized mass production, has passed the certification of several major customers at home and abroad and obtained orders. The company is focusing on the high-precision ceramic industry, our conpany is committed to becoming the global leader in bonding materials for semiconductor chips. 苏州芯合半导体材料有限公司主要从事于半导体芯片键合材料之陶瓷劈刀的研发和制造，陶瓷劈刀广泛用于半导体IC封装，Led封装，是芯片封装键合工艺中的核心材料，是中国第一家中高端市场完全国际化的陶瓷劈刀研发和制造企业，在陶瓷原材料准备、成型加工、表面处理、设备研发等方面完全自主掌握核心技术并实现批量化功生产。公司聚焦于高精密材料行业，积极推出材料新业务，致力于成为高精密材料领军企业，为中国高端材料和半导体崛起起航“芯”篇章。