Chengdu ECHINT IC Co.,Ltd.

Chengdu ECHINT IC Co.,Ltd. has the high density board level technology capability comparable to wafer level precision. The technology platform can correspond to 2D FO, 2.xD, PoP and other advanced system integratión packaging and Chiplet program. The company takes board level system integration technology as the core, integrating the front and back end of semiconductor to privde customers with one-stop,cost-effective customized solutions.

成都奕成集成电路有限公司具有媲美晶圆级精度的高密板级工艺能力，技术平台可对应2DFO、2.xD、PoP等先进系统集成封装及Chiplet方案，公司以板级系统集成技术为核心，整合半导体前后端，为客户提供一站式、高性价比的定制化解决方案。