Chris Scanlan is Vice President of Worldwide Applications Engineering at JCET Group where he is responsible for business development, technical program management, and product design.
Prior to joining JCET he was SVP of Product Development at Deca Technologies, a wafer level packaging technology provider. As a founding member of Deca, Chris was primarily responsible for the development of Deca’s portfolio of intellectual property relating to M-Series fan-out, Adaptive Patterning and advanced wafer-level manufacturing methods. Chris worked at Amkor Technology for 10 years where he held leadership positions including VP of Global R&D, VP of the Advanced Products business unit and VP of the System-in-Package business unit. Chris started his career at Motorola Semiconductor where we developed a manufacturing line for high power IGBT modules, and managed the transfer of Motorola’s fcCSP technology form R&D to production. He has over 60 issued US patents related to semiconductor packaging.