Maria Daniela Perez

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2025 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Meet Eloise Bond, Senior Etch Process Engineer at KLA Corporation (SPTS Division)Eloise Bond studied Physics at Swansea University before joining KLA in 2019 as an Etch Process Engineer. Since then, she has worked on cutting-edge semiconductor applications while actively promoting STEM through local outreach programs like Generation Tech.A proud recipient of the SEMI Europe 20 Under 30 Award, Bond shares how the recognition boosted her confidence and expanded her network, enabling her to take on new challenges. In her interview, she reflects on overcoming imposter syndrome, the value of flexible work, and the unexpected opportunities that shaped her career. Outside of work, Bond enjoys camping and bouldering.SEMI: What inspired you to join the semiconductor industry? Bond: I’ve always had a passion for science, so pursuing a career in a related field was natural. However, I wasn’t aware of the semiconductor industry until I began studying Physics at Swansea University, which has strong research ties with local semiconductor companies like KLA. Now that I am in the industry, I enjoy the hands-on aspects of my job. I find working with different materials and equipment is more engaging to me than an office-based job. SEMI: How did your early experiences and education shape your career path?Bond: STEM activities during my childhood and visits to museums with my parents sparked my interest in science and the physical world. That curiosity lead me to study physics at Swansea University, which ultimately paved the way to my current role at KLA. As I mentioned earlier, a career in semiconductors wasn’t really a conscious choice until relatively late in my education; I simply followed my passion for science. Today, I’m involved in many of the STEM outreach programs at KLA, helping to promote the semiconductor industry to young children so they can discover the same opportunities that I was fortunate to have had exposure to earlier in my life.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Bond: One accomplishment I’m particularly proud of is building strong customer relationships with a volume production fab in Korea. It was my first experience with direct customer interactions, which felt quite daunting at the time. I was invited to support a tool installation on-site, which allowed me to travel the furthest from the UK I had ever gone. Seeing firsthand how our tools fit into the wider industry gave me valuable context for my day-to-day responsibilities and made my work feel even more impactful. SEMI: As a young professional in the industry, what is your greatest challenge? Bond: Imposter syndrome has been a significant challenge for me. I often find myself in meetings with more senior colleagues and fear I am not performing well enough. However, over time, I have learned that my input is valid and that having multiple perspectives often leads to better outcomes.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Bond: To make a difference, you first need to be part of the industry, just getting involved puts you in the room where conversations and decisions happen that you might not otherwise be exposed to.If an opportunity comes your way, take it. I entered this industry due to an opportunity presented to me at the end of my university career. KLA was my first real interview, and I honestly thought my chances were slim. I approached it as a ‘trial run’ and five years later, I’m still here. SEMI: How do you envision future work environments?Bond: I envision a new generation of management that places greater value on work-life balance. In many industries, senior management seem to have a relatively poor work-life balance, such as constantly doing business in the same way they’ve done for the past 40+ years – with constant business travel, working on holidays and long hours in the office. There is still an expectation for younger, ambitious employees to emulate this corporate culture, which creates barriers for those with caregiving responsibilities or other important commitments outside work. I believe a younger, more vocal generation of managers will drive positive changes in how we work. We will see more adoption of fully flexible working and 4-day weeks – happy employees lead to better work outcomes. I also think the technological advances which enabled the rapid switch to “working from home” during the COVID pandemic have permanently reshaped what is possible in terms of flexibly and efficiently.SEMI: What impact has the 20 Under 30 Award had on your career? Bond: This award has given me greater confidence to step outside of my comfort zone. It has also allowed me to increase my network to include colleagues I would have no reason to speak to previously. As a result, I have gained broader knowledge of how KLA operates as a whole and have been able to initiate small cross departmental projects I would not have been possible to before. Following 20 Under 30 JourneysEloise Bond’s journey highlights the passion, resilience, and forward-thinking mindset that characterize today’s emerging leaders in semiconductors. Her dedication to both technical excellence and community engagement showcases how rising stars are not only advancing the industry but also inspiring the next generation.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

The semiconductor industry is at the heart of modern technology, powering everything from smartphones and medical devices to communication systems and transportation. However, to sustain its rapid growth and innovation, the industry faces a pressing challenge: a growing talent gap. Addressing this issue requires collaboration between academia and industry to ensure that students are not only equipped with the necessary skills but also have clear pathways into the workforce.That’s where SEMI On Campus comes in. Launched in March 2025 by SEMI Europe, this new initiative is designed to bring together the semiconductor industry and universities, fostering collaboration that benefits students, educational institutions, and companies alike. With its first edition in Poland, SEMI On Campus is already making waves by reaching over 150 students and strengthening industry-academia connections.First Stop: PolandThe inaugural SEMI On Campus event took place at Gdańsk University of Technology and The University of Gdańsk, where key representatives from SEMI Europe—Bernard Capraro (Senior Manager, University Partnerships Talent Initiative), Victoria Cummings (Senior Manager, Workforce Development EU Projects), Maria Daniela Perez (Senior Manager, Business Development), and Kartikey Srivastava (Senior Specialist, Communications)—met with deans, professors, and students from various faculties.The Power of Industry-Academia CollaborationCollaboration between universities and the semiconductor industry is crucial in ensuring students gain practical knowledge, hands-on experience, and direct access to job opportunities. Companies, in turn, benefit from a steady pipeline of skilled graduates ready to drive innovation and meet industry demands.During the event, Bernard Capraro shared his own journey, from an engineering internship in Germany to leading research and development initiatives at Intel. His experience highlighted how diverse skill sets and career paths can lead to impactful roles in the semiconductor industry."Yes, the industry needs mechatronics engineers, data scientists, chemists, physicists, and computer science professionals. But it also needs media experts, gamers, biologists, environmentalists, public policy professionals, and communicators. It’s all about transferable skills and finding your area in this dynamic and diverse industry,” said Capraro.Expanding Opportunities with the European Chips Skills AcademyOne of the key initiatives supporting the semiconductor industry’s workforce development is the European Chips Skills Academy (ECSA). Designed to tackle skills shortages and propel industry growth, the Academy builds on the goals of the Microelectronics Pact for Skills and the EU Chips Act. With backing from 18 partners, including vocational training providers, research organizations, and industry leaders, ECSA aims to:Attract new talent into microelectronicsFoster collaboration between educational institutions and industryProvide training and certification opportunities to enhance workforce readinessVictoria Cummings emphasized how the initiative offers mentorship programs and access to leading companies and events. ECSA also builds on the student ambassador initiative, empowering institutions to support students in developing ideas and connecting them with mentors who can help shape their careers.Driving Diversity with the European Chips Diversity AllianceDiversity, equity, and inclusion are key to strengthening the semiconductor workforce. Kartikey Srivastava highlighted the European Chips Diversity Alliance (ECDA), a collaborative effort between academia and industry that aims to lower barriers to participation for underrepresented groups.With 11 partner organizations, the ECDA seeks to enhance inclusivity in the microelectronics sector, ensuring that the industry remains competitive and accessible to all. By fostering inclusive talent pipelines, the initiative is helping shape a more equitable and innovative future.A Successful Launch with a Bright FutureThe first SEMI On Campus event was a tremendous success, not only for the students who gained valuable insights and networking opportunities but also for universities and industry leaders looking to strengthen their collaboration. By building bridges between academia and industry, SEMI On Campus is paving the way for a more skilled and dynamic semiconductor workforce in Europe.If you’re interested in hosting a SEMI On Campus initiative or inviting an industry representative to speak at your institution, please reach out to [email protected]. Let’s work together to inspire the next generation of semiconductor leaders!SEMI Contact: Maria Daniela Perez, Senior Manager Business DevelopmentEmail: [email protected] Lam, Manager Business DevelopmentEmail: [email protected]

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2025 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Mariusz Grabowski: Lead Design Engineer at Cadence Design SystemsMariusz Grabowski, a 2023 20 Under 30 award recipient at the age of 24. He is now a Lead Design Engineer at Cadence Design Systems, Inc., where he’s been making strides in digital systems design for nearly three years. Prior to this role, he gained valuable experience as an FPGA Design and Verification Engineer at Aldec Inc. Grabowski holds a master’s degree with distinction in automation and robotics from AGH University of Science and Technology in Krakow, Poland. During his academic career, he was an active member of both the Avader and Integra Scientific Groups. He also achieved recognition at events like DASIP 2023 and in the International FPGA Hackathon, where he and his team earned 2nd and 3rd place. He is currently also pursuing a postgraduate degree in Project Management at SGH Warsaw School of Economics. SEMI: What inspired you to join the semiconductor industry? Grabowski: I have always been fascinated by the fundamental workings of advanced systems and that curiosity led me to pursue a career in the semiconductor industry. As a digital design engineer, it is exciting for me to contribute to the creation of such large and sophisticated architectures from basic building blocks. Now, I’m proud to be a part of Cadence Design Systems, where I can work on the cutting-edge designs with some of the most talented and hard-working engineers. Grabowski and his team at the awards ceremony at FPGA Hackathon 2023SEMI: How did your early experiences and education shape your career path?Grabowski: During my studies, I had the opportunity to work on hands-on projects with an FPGA platform, which led me to my first job as an FPGA design and verification engineer. That experience gave me a broader perspective on the industry’s scale and reinforced my passion for tackling challenges, learning and growing in this field.Grabowski presenting his paper at the DASIP 2023 ConferenceSEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you? Grabowski: For me, it is successfully balancing full-time studies with work. It was a challenging experience, but it provided invaluable opportunities to grow my skills and gain hands-on experience. During that time, I completed numerous projects, participated in scientific conferences and industry events like DASIP 2023, and even earned 2nd and 3rd place in the International FPGA Hackathon. These achievements reinforced my passion for the field and my ability to thrive under pressure. SEMI: As a young professional in the industry, what is your greatest challenge? Grabowski: One of the biggest challenges is navigating the complexity of large-scale projects, where seamless coordination between multiple teams across the globe is crucial. As someone still early in my career, gaining the experience to manage the cross-functional aspects of a project while ensuring my own contributions are technically sound has been both demanding and rewarding.Grabowski at the Discussion Panel on Industry Career Perspectives at DATE 2024 ConferenceSEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Grabowski: The sheer amount of information and complexity in the industry can feel overwhelming. It is essential to embrace curiosity and continuous learning, but it is also crucial to recognize that you can’t do everything alone. My advice is to find your area of expertise and collaborate with others; teamwork is key to bringing impactful projects to life. Cadence’s Design Team in Warsaw, Poland Manager Jacek Rosiak—3rd from the leftSEMI: How do you envision future work environments? Grabowski: I envision future work environments as places where technology fosters creativity and collaboration, diversity is celebrated, and flexibility and work-life balance are prioritized. These environments will empower employees to perform at their best while feeling supported and valued. I am proud to be a part of Cadence Design Systems, where I feel that these values are strongly cultivated. SEMI: What impact has the 20 Under 30 Award had on your career? Grabowski: Receiving the 20 Under 30 Award was an incredible validation of the hard work I’ve put into my role. It gave me a confidence boost, affirming that I am on the right path and capable of making meaningful contributions to my company and the broader semiconductor industry. It also brought significant recognition, which opens up numerous opportunities.Following 20 Under 30 JourneysMariusz Grabowski’s journey in the semiconductor industry highlights the power of dedication, curiosity, and continuous learning. From his early experiences with FPGA platforms to his significant accomplishments in both academia and industry, Grabowski is a true example of how passion and hard work can drive meaningful contributions. As a young professional, his insights offer valuable inspiration for the next generation of engineers eager to make their mark in this ever-evolving field. With a bright future ahead, Grabowski is sure to continue influencing the world of technology, one innovative project at a time.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

As artificial intelligence (AI) continues to revolutionize industries, the technology behind AI chips is advancing at an unprecedented pace. Meeting the demands of faster processing, greater efficiency, and increased complexity requires cutting-edge solutions in semiconductor manufacturing. SEMI spoke with Kai Beckmann, Member of the Executive Board at Merck KGaA, Darmstadt, Germany and CEO of the Electronics business sector, who shared insights into Merck KGaA, Darmstadt, Germany's latest strategic move that underscores the company’s commitment to innovation in semiconductor and optics technologies. With the acquisition of Unity-SC, a leading provider of advanced measurement and inspection technology, this marks a significant milestone in the evolution of AI chip manufacturing and beyond by bridging expertise in electronics and optics to drive innovation.Strengthening AI Chip Manufacturing with Unity-SC On October 31, 2024, Merck KGaA, Darmstadt, Germany’s Electronics business acquired Unity-SC, a global leader in metrology tools for semiconductors. According to Beckmann, this acquisition not only enhances Merck KGaA, Darmstadt, Germany’s portfolio in advanced measurement and quality inspection but also bolsters its position in the development of AI chips. These chips, essential for driving AI, rely on cutting-edge manufacturing processes like advanced packaging and heterogeneous integration.“Unity-SC brings precision to the table,” Beckmann explained. “Its technology is vital for managing the complex production sequences involved in creating high-density, three-dimensional chip structures. Without this precision, the production of AI chips at the necessary scale and quality would be nearly impossible.”The expertise of Unity-SC is pivotal for ensuring reliability in semiconductor manufacturing, reducing waste, and optimizing performance. With Merck KGaA, Darmstadt, Germany’s established relationships with major chip manufacturers, the integration of Unity-SC's technology is set to create synergies that will benefit the entire industry.A New Era for Merck KGaA, Darmstadt, Germany: Electronics Meets OpticsThe acquisition of Unity-SC aligns with Merck KGaA, Darmstadt, Germany’s broader strategy of combining expertise in semiconductors and optics, a vision that includes rebranding its display business as Optronics. This move represents a transformation from a traditional display specialist to a pioneer in optical technologies that complement electronic advancements. “Integrating optics with electronics opens up vast opportunities,” Beckmann shared. He highlighted key areas of focus like silicon photonics, which is revolutionizing data transmission, and augmented reality, where lightweight, powerful headsets represent the next frontier.Merck KGaA, Darmstadt, Germany’s foray into these domains underscores the importance of merging light management and materials expertise. For instance, the precision metrology brought by Unity-SC dovetails with Merck KGaA, Darmstadt, Germany’s work in materials science, forming a foundation for advancements in next-generation technologies such as quantum computing and neuromorphic systems. Driving Innovation in AIAdvanced packaging and heterogeneous integration are at the core of today’s AI revolution. These technologies make it possible to stack chips in 3D configurations, reducing energy consumption and increasing processing power. “Unity-SC plays a crucial role in this process,” Beckmann noted, emphasizing that the precise measurement of intricate structures ensures the reliability and efficiency of these complex systems.By mastering these technologies, Merck KGaA, Darmstadt, Germany is positioning itself as a leader in both materials and metrology for semiconductor manufacturing. “Integrating metrology and inspection into our portfolio is a leap forward in aligning our expertise with the needs of the AI-driven semiconductor industry,” Beckmann said. Looking AheadMerck KGaA, Darmstadt, Germany’s combination of semiconductor and optics expertise is not just about advancing technology but about creating a stronger, more resilient organization capable of tackling future challenges. The integration of Unity-SC is a step toward achieving this vision, fostering innovation at the intersection of light and materials.“Working in the semiconductor industry has always been exciting,” Beckmann shared. “But now, with AI reshaping the landscape, the opportunities for innovation and growth are unparalleled. Together with Unity-SC, we’re not just keeping pace—we’re leading the charge.”Merck KGaA, Darmstadt, Germany’s strategic evolution signals a promising future for AI, semiconductors, and the broader field of optoelectronics, where the interplay of light and materials continues to unlock new horizons.Kai Beckmann is a Member of the Executive Board of Merck KGaA, Darmstadt, Germany and CEO of the Electronics business sector. Joining Merck KGaA, Darmstadt, Germany in 1989, he has held roles in IT, consulting, and international management, including as Merck KGaA, Darmstadt, Germany’s first CIO. Since 2017, he has led the Electronics sector (operating under the name EMD Electronics in the US and Canada), driving innovation in semiconductors and optics. Beckmann also oversees the Darmstadt site and co-determination in Germany. He holds a computer science degree from TU Darmstadt and a doctorate in economics earned in 1998.SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Raphael Hardegger: Product Manager Advanced Products at VATRaphael Hardegger is a Product Manager at VAT, where he leads the development of innovative atomic layer deposition (ALD) valve technology. Starting his career in 2009 as a design engineer apprentice at VAT, Raphael has since gained diverse experience, including entrepreneurial ventures and a role in MedTech. Today, he focuses on shaping product strategy, aligning solutions with customer needs, and driving impactful advancements in the semiconductor industry.SEMI: What inspired you to join the semiconductor industry? Hardegger: I joined the semiconductor industry, and VAT in particular, at the young age of 15. Back then, I started as a design engineer in VAT’s apprenticeship program. Growing up in the beautiful VAT region, my entry into the industry was somewhat by chance – but I’m incredibly glad it happened! After gaining foundational knowledge at VAT, I pursued studies in mechanical engineering, worked in various other roles and companies, and then completed a master’s in business innovation. About 3.5 years ago, the semiconductor industry pulled me back in, and I haven’t looked back since. What keeps me excited about VAT and the industry as a whole is its sheer complexity. Every day, we have the opportunity to innovate with small components that have a significant impact on a huge industry. It’s such a multifaceted field that I’m confident I’ll continue learning something new every day for the rest of my career.SEMI: How did your early experiences and education shape your career path?Hardegger: In Switzerland, the apprenticeship model uses a results-oriented work style from an early age. The lessons I learned during my four years as an apprentice at VAT continue to influence my daily work life. The mechanical foundation I built during that time remains a tremendous asset in my career. When combined with my studies in systems engineering and business innovation, this foundation has allowed me to make a meaningful impact both at VAT and within the broader industry.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you? Raphael Hardegger in the VAT office of San Jose, California, USA, holding the new product he worked on.Hardegger: When I rejoined VAT as a product manager, I was given the opportunity to manage a new product that wasn’t even on the market yet. This product was a key part of VAT’s strategy to outpace market growth by expanding into new product segments beyond our core offerings. I had the privilege of collaborating with some of VAT’s most talented engineers, who developed an incredible product. Together, we learned a great deal through our initial interactions with customers, refining the product to meet stringent requirements. This year, we successfully qualified the product for use in the industry’s most challenging semiconductor processes. It’s a testament to how dedication, customer-focused engineering and exceptional teamwork can make a significant impact. What makes me proud is not just working on innovative concepts, but creating products that truly excite our customers and contribute to meaningful growth for VAT.SEMI: As a young professional in the industry, what is your greatest challenge? Hardegger: I turned 30 this year, so I suspect I was one of the oldest 20 under 30 winners last year. One challenge I’ve faced — not only in this industry, but across others — is impatience. As a young professional with high aspirations, it’s easy to feel that things aren’t moving fast enough. We often expect early promotions, annual salary increases, and quick recognition for our efforts. What changed my perception on this was a conversation with a senior manager at VAT shortly after I joined. I asked him what steps I should take to move closer to my next career goal, such as earning a management position. His response was simple and direct: Focus on making an impact in your current role. Build a strong track record and demonstrate your skills. Everything else will follow. I took his advice, and I'm glad I did. No, I didn't get promoted immediately, but I learned the value of patience, doing my best every day, and finding satisfaction in the process.Career progression isn’t just about motivation and talent — it’s also about timing and aligning with the business needs. Being impatient or pushing for premature career moves can often backfire, leaving you in a worse position than before. By focusing on making a genuine impact and building a solid track record, you create a strong foundation for a fulfilling and sustainable career.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Hardegger: You're in a great place — right where you need to be. Be curious and explore as much of the semiconductor industry as you can. During my training as a design engineer, I wasn't deeply involved in understanding the customer applications our valves were serving. My focus was primarily on developing vacuum valves based on product management requirements and manufacturing needs. Since I returned, I've learned the importance of understanding what our customers truly need and translating those needs into product requirements.This shift has not only helped me and the team create better products, but also made the work much more enjoyable! While I'd still like to deepen my understanding of customers' processes, it's already fascinating to learn more about their goals and see how our products can make a real difference. If I could go back to my apprenticeship or just starting this industry, my advice to myself — and to anyone starting out — would be to stay as curious as possible. Take every opportunity to learn what customers are trying to achieve with the products you help create. That curiosity will guide you to make a meaningful impact.SEMI: How do you envision future work environments? Hardegger: To me, having a clear customer focus in every aspect of a company's efforts is essential. At the end of the day, someone needs to want to buy our products for us to remain profitable and continue to grow. That’s why maintaining a customer-centric approach in all aspects of product development and management is critical. At the same time, the people who work in such companies need to be happy and fulfilled to create great products. I appreciate the recent trends we’re seeing to improve the corporate culture, such as embracing hybrid working models. These approaches provide a healthy balance between in-office collaboration and focused work from home, helping employees maintain productivity and well-being.SEMI: What impact has the 20 Under 30 Award had on your career? Hardegger: While I deeply appreciate the recognition that comes with such awards, I believe my career should ultimately be defined by the impact I make in my field. That said, I do hope the award inspires other young professionals to explore this exciting industry and build meaningful careers here! Following 20 Under 30 JourneysRaphael Hardegger’s journey in the semiconductor industry is a testament to the power of curiosity, dedication, and a customer-centric approach. From his early days as a design engineer apprentice to his current leadership in product innovation, Raphael continues to drive meaningful change at VAT Group. His story inspires young professionals to embrace continuous learning, focus on making a real impact, and contribute to the growth and success of the semiconductor industry.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

New pilot lines offer European innovators access to the most advanced semiconductor technologies for product development and validation.The global semiconductor landscape has undergone significant transformation in recent years. With disruptions such as the semiconductor supply chain crisis and the challenges it posed to the automotive sector, Europe’s dependence on external fabrication facilities, particularly in Taiwan, has become a pressing concern. In response, the European Union (EU) introduced the EU Chips Act, a comprehensive framework designed to reduce this reliance and boost Europe’s share of the global semiconductor market. ITF Chip into the Future, hosted by imec at SEMICON Europa 2024, was a pivotal event that brought together industry leaders, policymakers, and experts to explore the implementation of the EU Chips Act and the future of Europe’s semiconductor ecosystem. Jari Kinaret, Executive Director of the Chips Joint Undertaking (Chips JU)—the body overseeing the EU’s semiconductor investments—explained, “The Chips JU is about capacity building to drive semiconductor innovation in Europe. We will continue to be dependent on the rest of the world, but we want to make sure that the rest of the world depends on us as well.” Jari Kinaret, Executive Director, Chips JUEuropean research is driving progress towards sub-nanometer fabricationOne of the pilot lines, located at imec’s research center in Belgium, is focused on advancing methods that push Moore’s Law forward by achieving smaller and more efficient circuit features. As Luc Van den hove, President and CEO of imec, explained, “imec is now powering innovation for tomorrow’s chip designs, including stacked layers of chips, with each layer containing specific functionality implemented on chip processes optimized for each function. This allows us to scale much further than if all functionality had to be implemented on a single monolithic layer.”Luc Van den hove, President and CEO, imec Another pilot line, based in France and operated by CEA-Leti, is focused on pushing the limits of technology across multiple dimensions. CEA-Leti CEO, Sébastien Dauvé, explained that the goal of the FAMES pilot line is to advance “not only FD-SOI at 10nm and 7nm nodes, but also novel non-volatile memory technologies, RF components, 3D integration, and the development of small inductors for DC-DC converters.” Sébastien Dauvé, CEO, CEA-LetiAdvancements in 3D integration and chiplet technologies are closely tied to innovation in chip packaging. Christoph Kutter, Executive Director of Fraunhofer EMS, described how the Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) pilot line in Germany is designed to meet the needs of industrial customers’ growing demand for advanced packaging solutions. Kutter noted “Customers told us that they needed to integrate logic and power, sensors and logic, and other combinations of functions. We have built the APECS pilot line to provide what they asked for.”Christoph Kutter, Executive Director, Fraunhofer EMSThe EU Chips Act is spurring investments not only in chip fabrication but also in the underlying technologies which support chipmaking. Emmanuel Sabonnadière, EVP at Soitec, highlighted how fabrication of advanced silicon carbide (SiC) power devices “is enabled by SmartSiC™ technology from Soitec – part of a built-in-Europe solution for silicon carbide.” Sabonnadière explained that SmartSiC technology “creates very thin layers of SiC material which make really differentiated substrates supporting the production of high-performance SiC devices.” Emmanuel Sabonnadière, EVP, SoitecInnovation in materials emerged as an important theme at ITF Chip into the Future. Julien Arcamone, Vice President of Corporate R D at ASM, described the critical role of materials for atomic layer deposition (ALD) in the advancing 3D semiconductor integration. Arcamone emphasized the importance of collaboration across the semiconductor value chain, describing ASM’s partnership with imec as part of “a win-win ecosystem.” Julien Arcamone, Vice President of Corporate R D, ASMDeveloping the skills to implement advanced semiconductor technologiesWhile the EU Chips Act is subsidizing the construction of new facilities including pilot lines needed for the hardware of the semiconductor industry’s expansion – the ITF speakers underlined the equally important “software” element of the semiconductor industry ecosystem: the knowledge and expertise of the people working in the industry. One of the biggest challenges in implementing the EU Chips Act is addressing Europe’s talent gap. Katrien Marent, Executive Vice President and Chief Marketing and Communications Officer at imec, said that the gap is in part “because students who graduate in STEM subjects are not trained in advanced semiconductor technologies.” From left to right: Katrien Marent, Executive Vice President and Chief Marketing and Communications Officer, imec; Julien Arcamone, Vice President of Corporate R D, ASM; Thomas Heurung, CEO, Siemens EDA; Frédérique Le Grevès, President STMicroelectronics France and Executive Vice President, Europe France Public Affairs, STMicroelectronics; Romano Hoofman, Director imec.IC-link, imec; and Christophe Frey, Vice-President of EU engagements Managing Director, ARM.Thomas Heurung, CEO of Siemens EDA, highlighted the need for educational reform in the electronics industry. He suggested that “we might not have the right degree-level curriculum for changing times in the electronics industry. We need to change the way that we train students at university, and we need more scope for early or mid-career training on specialist micro-curriculums aimed at a particular skill or knowledge set.”The industry also struggles to attract individuals. Frédérique Le Grevès, President of STMicroelectronics France and Executive Vice President, Europe France Public Affairs of STMicroelectronics, emphasizes the importance of rebranding the industry to attract new talent. She remarked, “The word ‘semiconductor’ itself isn't very exciting—it’s even off-putting to some. By simply changing the name of educational programs, we’ve seen significant increases in enrollment. This demonstrates the power of language in shaping perceptions and interest.”Thomas Heurung of Siemens EDA also called for a stronger emphasis on entrepreneurship, noting “there is a big contrast between Europe and the US, particularly Silicon Valley.” He explained how his company’s Cre8Ventures unit had been set up to help start-ups through the key stages of creating a successful new company, including product development, attracting funding, and bringing the product to market. Thomas Fleischmann, Program Manager at Robert Bosch, explained how the EU Chips Act has accelerated the formation of the European Semiconductor Manufacturing Company (ESMC) joint venture, in which Bosch is a key stakeholder. ESMC is building a new semiconductor fabrication plant in Dresden, dedicated to producing chips for the automotive and industrial sectors. Fleischmann emphasized that ESMC will play a crucial role in helping Europe “scale advanced technologies to high volumes at a competitive cost.”In addition, the EU Chips Act also provides a broader platform for the expansion of Europe’s deep tech capacity. This includes the creation of five pilot lines, which will offer European companies access to manufacturing capacity for prototyping at the most advanced semiconductor technology nodes.Thomas Fleischmann, Program Manager, Robert BoschITF Chip into the Future at SEMICON Europa 2024 highlighted the broad scope of the EU Chips Act – not only supporting the building of advanced fabs but also providing the foundations for technology development, production, and marketing – all aimed at supporting semiconductor innovation in Europe. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

In the rapidly-evolving semiconductor industry, maintaining a competitive edge is crucial. To position Europe at the forefront of global semiconductor innovation, imec is leading the NanoIC pilot line initiative. Aligned with the European Chips Act, this initiative is a strategic move to bolster Europe's leadership in key markets like high performance computing, automotive, and healthcare.SEMI spoke with Srikanth Samavedam and Jo De Boeck from imec, Belgium, to learn more about the NanoIC pilot line and to better understand its goals, challenges, and prospects. From transitioning to gate-all-around (GAA) nanosheet devices, to developing advanced memory technologies and interconnects, this conversation highlights the cutting-edge advancements made possible through collaboration across the industry’s value chain.SEMI: How is the NanoIC pilot line working to revolutionize the semiconductor industry, and what are its main objectives?Samavedam: The NanoIC pilot line is a European initiative aimed at bridging the gap between R D and industrial innovation. The project is creating a beyond-2nm system-on-chip (SoC) pilot line, developing advanced logic, memory, and interconnect technologies. This effort supports the European Chips Act's vision for leadership and competitiveness in global semiconductor innovation, particularly in critical markets like high performance computing, communication, automotive, energy, and healthcare. However, advanced technologies come with more complexity, and addressing these complexity challenges requires more mature module baseline flows. By improving baseline flow repeatability and variability while reducing defectivity, we can accelerate the development of future technologies. The NanoIC pilot line is working to provide access to these advanced technologies and baselines to develop future compute systems. This will help ensure European competitiveness across the industry – from semiconductor materials, equipment and design to systems and applications.SEMI: Who are the core partners involved in this initiative?De Boeck: Key partners of the pilot line include CEA-Leti, Fraunhofer-Gesellschaft, VTT Technical Research Centre of Finland, Tyndall National Institute, and the Center for Surface Science and Nanotechnology of the University POLITEHNICA of Bucharest. This project is also supported by the Flemish government, other participating states, and the Chips Joint Undertaking of the EU Chips Act.These institutions and organizations bring a wealth of knowledge and resources, and imec compliments their efforts by providing access to its global partnerships with key industry leaders. The NanoIC pilot line is helping strengthen Europe’s global semiconductor industry leadership while aligning efforts with other regional Chips Acts. SEMI: Can you elaborate on the significance of transitioning from field-effect transistors (FinFETs) transistors to GAA nanosheet devices in CMOS technology?Samavedam: The transition from FinFETs to GAA nanosheet devices is a significant advancement in CMOS device technology. FinFETs have been the backbone of CMOS technology from the 22nm to the 3nm node. But starting at the 2nm node, nanosheet devices will need to be introduced. Nanosheet devices, including variants like Forksheet devices, are expected to drive scaling and performance through three generations – 2nm, A14, and A10. Complementary FET (CFET) architectures are also expected to be introduced around 2031 at the A7 node, which will represent another major inflection point in CMOS device design. This progression requires extensive research into new materials, process modules, equipment, and advanced patterning capabilities using high numerical aperture extreme ultraviolet (high NA EUV) lithography – all of which will be implemented on the NanoIC pilot line. FIGURE PROVIDED BY IMEC │ SCHEMATIC ILLUSTRATION OF A FUTURE COMPUTE SYSTEM. THE SYSTEM IS MADE OF LARGE MULTI-DIE ELECTRICAL-OPTICAL INTERPOSER PROVIDING ELECTRICAL AND OPTICAL INTERCONNECTS BETWEEN THE VARIOUS CHIPLETS (CPUS, GPUS, HBM). ALSO SHOWN ARE CONNECTIONS TO PACKAGE SUBSTRATE, AS WELL AS FIBER CONNECTORS AND AN INTEGRATED LASER SOURCE. CENTRAL PROCESSING UNIT (CPU); GRAPHICS PROCESSING UNIT (GPU); HIGH BANDWITH MEMORY (HBM); PROCESSING UNIT THAT CAN INCLUDE CPUS, GPUS, AND OTHER SPECIALIZED PROCESSORS (XPU); APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC); ELECTRONIC INTEGRATED CIRCUIT (EIC); FF-LEVEL: FEMTOFARAD-LEVEL; FIELD-PROGRAMMABLE GATE ARRAY (FGPA); GAAS QD: GALLIUM ARSENIDE QUANTUM DOT; INTEGRATED SILICON PHOTONICS PLATFORM 300MM (ISIPP300); REDISTRIBUTION LAYER (RDL); SILICON PHOTONICS (SIPHO); THROUGH PACKAGE VIA (TPV). SEMI: What are the key innovations necessary for advancing memory technology?Samavedam: As SRAM scaling slows, the exploration of novel, dense embedded memory concepts will become imperative. Technologies like spin orbit torque magnetic RAM (SOT-MRAM) and 2-transistor 0-capacitor (2T0C) embedded DRAM using deposited semiconductors like indium gallium zinc oxide (IGZO) are promising. These innovations address memory capacity and bandwidth challenges from new workloads in compute systems. Additionally, developing a 3D memory platform to explore future memory options will be essential for improving SRAM and DRAM. These advancements will help meet the demands of new applications like machine learning, augmented and virtual reality, and autonomous vehicles.SEMI: How do advanced interconnect technologies contribute to the future of semiconductor design?Samavedam: Advanced interconnect technologies, like chip-to-chip lateral (2.5D or interposer technologies) and vertical interconnects (3D technologies), play a crucial role in addressing memory capacity and bandwidth challenges. These technologies enable the partitioning of SoC functions into separate dies, allowing for more efficient and scalable designs. Advances like pitch scaling of micro-bumps and copper (Cu) hybrid bonding are facilitating this fine-grained partitioning of SoC functions. Additionally, optical interconnects and 3D interconnect-enabled co-packaging provide high-bandwidth and low-power connectivity at wafer scale. The rise of chiplet architectures and standardization will also increase the demand for low-cost, tight-pitch interconnect technologies like Cu/polymer redistribution layers.SEMI: How do your collaborators benefit from the NanoIC pilot line? De Boeck: One of the biggest collaborator benefits is the pilot line’s commitment to knowledge sharing through R D access and training. We invite foundries, IDMs, materials suppliers, equipment suppliers, and system companies/OEMs to jointly develop the materials, process modules, and integration flows to accelerate the development of beyond-2nm SoC technology pillars.Design pathfinding and system exploration process design kits (PDKs) will be available for start-ups, small- and medium enterprises, universities, and design and system companies to aid in prototyping and testing their designs. The NanoIC pilot line will also offer comprehensive training programs, including virtual PDK training, bootcamps for faculty, and internships and expert courses for students. To learn more, experts and key partners of the NanoIC pilot line will be presenting from 14 -16:40 at SEMICON Europa on November 12. imec’s program, ITF Chip into the Future, will highlight advancements in digital technology, capacity building through the European Chips Act, and the role of the NanoIC pilot line in accelerating beyond-2nm innovation. The conversation will also address industry requirements for pilot lines, emerging initiatives boosting Europe’s innovation and competitiveness, and perspectives on advanced materials and semiconductor equipment. Srikanth Samavedam, Senior Vice President of Semiconductor Technologies at imec, oversees programs in logic, memory, photonics, and 3D integration. Previously, he was a senior director at GlobalFoundries, leading 14nm FinFET technology into production and developing 7nm CMOS. Starting his career at Motorola, he worked on strained silicon and other advanced materials. He holds a Ph.D. in materials science and engineering from MIT and a master's degree from Purdue University. Jo De Boeck, Executive Vice President and Chief Strategy Officer at imec, oversees the company’s strategic direction and serves on its executive board. He joined imec in 1991 after earning his Ph.D. from KU Leuven and has since held various leadership roles, including head of imec’s Smart Systems and Energy Technology business unit and CTO. De Boeck is also a part-time professor at KU Leuven. Maria Daniela Perez / Communications Manager, SEMI EuropePhone: +49 160 2562977Email: [email protected]

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys, and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Marieke Vermeulen: Product Quality Assurance Engineer at MelexisMarieke Vermeulen's journey into the semiconductor industry is a testament to curiosity, adaptability, and self-driven learning. With a background in classical philology, her entry into Melexis as a customer quality technician was unexpected, yet she quickly embraced the challenges of the industry. Through her commitment to growth and innovation, Marieke has risen to the role of Product Engineer, demonstrating leadership and a passion for continuous improvement. Her contributions, particularly in product ownership and driving business growth, highlight her as a dynamic force within Melexis, embodying both technical excellence and a collaborative spirit.SEMI: What inspired you to join the semiconductor industry? Vermeulen: My entry into the semiconductor industry was actually quite accidental. After completing my master’s degree in classical philology, I was still unsure about which direction I wanted my professional life to take. Then, an opportunity arose to join Melexis as a customer quality technician.I did not have anyone in my immediate circle with experience in the industry, so I entered the field without really knowing what to expect. I had only a vague idea of what a semiconductor company did. However, from those early days onwards, I have not looked back. It is my love of knowledge and the desire for a deeper understanding that continues to drive me in my role within Melexis’s quality department. During my literature studies, I was motivated by the idea that there is no absolute, uncontestable truth. Meaning will change with time and place. This perspective aligns closely with the mindset of the semiconductor industry. With new inventions and concepts constantly emerging, the industry is always evolving. We must challenge what we believe to be true yesterday and adapt to the discoveries and advancements for today.So, while there was no direct inspiration that led me to join, more of a stumble into the field, I have since developed a deep respect for how the industry operates. I In particular, I respect how people in the industry do not hesitate to question in order to keep pushing the boundaries of innovation.SEMI: How did your early experiences and education shape your career path?Vermeulen: There was no direct experience. During my school years, STEM was just beginning to earn its place in my educational framework, and we were only introduced to the basic principles. Fortunately, this has changed significantly since then. However, my background hasn’t held me back, in fact, quite the opposite.One main principle from my studies stands out: in language, nothing is set in stone. There is no single truth, no single solution and no single voice. At its heart, language is shaped by human interaction. My studies taught me to think critically and to understand that there is always more than one answer to a question. This approach directly influences the way we work in the product quality department. Our goal is to develop and produce products that meet a customer’s needs as closely as possible. But it is a continuous process and very rarely a straight line. We learn from our past experience to improve the next iteration, again and again. We regularly consult with our peers to gather different ideas, and we listen to the industry to understand where the needs are. Then, we translate those insights into an effective solution.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Vermeulen: Our products go through two main stages in their lifecycle: development and production. As a product engineer, I am responsible during the production stage. However, before we reach this point, there is a transition period where the development and production teams come together to prepare the product for the best possible launch. This period is often hectic, but it clearly demonstrates how much of a team effort our products represent. Every team member understands their role and works towards the collective goal. Being part of such a diverse team and seeing our products succeed is always a thrill for me. While the products are made with metals, silicon, and other elements, it is the human factor that truly brings them to life. The very first spark is always the idea to create. SEMI: As a young professional in the industry, what is your greatest challenge? Vermeulen: As a young woman in STEM, the most obvious answer is that I have to prove myself more than my male colleagues or more experienced peers. However, at Melexis, I have found strong support in overcoming this challenge. Our voices are heard, and we are an active and valued part of our teams. We can express our ideas freely, knowing they will be considered just as seriously as anyone else’s. I can only hope this trend continues throughout the industry.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Vermeulen: To those who are unsure if STEM is truly for them, I would say: We need engineers, but we also need dreamers to bring the ideas to life. We need designers and coders who can make the device function, but we also need people who can communicate these concepts to the world. Moreover, we need educators who can inspire and teach the next generations. There is a place for many different minds within the industry, so I encourage you to step in this direction. I’m sure you will find a place.And for those inspired by the semiconductor world and are sure this is where they want to be: don’t be afraid to look beyond the industry. Listen to those around you and take their ideas to heart. Be the inventor for those who cannot bring ideas to life, and offer solutions to those who feel stuck.Cooperation has made our industry great, and it is essential for building a strong foundation moving forward. SEMI: How do you envision future work environments?Vermeulen: The past few years have demonstrated how advanced technology has made the world much smaller. With just a click of a button, a camera, and a microphone, we can connect to the world, ignoring the constrains of time, space and borders. This accessibility opens the door for many more people to enter the industry from all around the globe. A hybrid and flexible work environment enhances this even further, accommodating those who might face physical or logistical restrictions. We need to continue on this path. By embracing diversity, we allow new ideas to emerge at the intersection of different minds. Why exclude a brilliant mind simply because they are on the other side of the continent? Why overlook someone whose mother tongue differs from yours when we can find a common language?At Melexis, we already welcome many different cultures, and it is amazing to see how vibrant this makes our offices. New team members bring their own experiences and blend them with ours. Just as alloys often retain characteristics of their base metals, these newly melded ideas will enrich our collective innovation.SEMI: What impact has the 20 Under 30 Award had on your career? Vermeulen: The award has connected me with wonderful peers and highlighted how we all strive to improve the industry, each in our own way and from our unique areas of expertise. It also has provided me an opportunity to demonstrate that the industry is welcoming to a variety of experiences and is willing to invest in its people. The goal was to foster connections, and it has truly jumpstarted this for me. Following 20 Under 30 JourneysMarieke Vermeulen's story is an inspiring example of how passion for learning and a willingness to embrace new challenges can lead to remarkable success. From her unexpected entry into the semiconductor industry to her achievements as a Product Engineer at Melexis, she has consistently demonstrated leadership, innovation, and dedication. Her journey highlights the importance of curiosity and adaptability in driving both personal and professional growth, making her a role model for others in the industry.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. For more information contact Maria Daniela Perez at [email protected] Daniela Perez is Communications Manager at SEMI Europe.

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys, and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Kai Hahn: Project Manager R D at Comet, Industrial X-Ray Systems DivisionKai Hahn’s journey began when he joined the company as a bachelor’s thesis student. His early drive and exceptional contributions quickly set him apart, earning him a role as a cooperative student while simultaneously serving as a "Change Manager." In this capacity, Hahn led high-impact business excellence initiatives, overseeing cross-functional projects at the executive level. Now, as a Project Manager in R D, Hahn leads agile teams developing cutting-edge automated inspection solutions. His leadership, marked by a commitment to innovation, collaboration, and customer satisfaction, drives both personal and organizational growth, making him a standout in the semiconductor industry.SEMI: What inspired you to join the semiconductor industry? Hahn: I didn't actively choose the semiconductor industry; rather, I grew into it together with our brands Comet Yxlon Dragonfly. Beyond the pioneering spirit our X-Ray System division has, what excites me the most is our direct connection to semiconductors. From turning off your morning alarm to driving to work, staying connected with friends and family, or watching a sports game on TV — semiconductors are everywhere and shape our daily lives. Working in this industry is both exciting and challenging. Every day, I look forward tackling new projects that push the boundaries of innovation. But what inspires me the most is the transformation that our division is undergoing. We are continuously adapting our processes and procedures to meet the growing demands of the market and our customers. Being part of this dynamic evolution is rewarding and exhilarating. SEMI: How did your early experiences and education shape your career path?Hahn: With my degree in business and engineering, I chose a program that covered a wide range of subjects. While I gained knowledge from a broad field, by the end of my bachelor's degree, I realized I lacked practical experience and a clear direction for my career.Joining Comet as an intern during my final year helped me anchor my career path. I decided to pursue my master's degree while working part-time for the company. This decision allowed me to gain relevant professional experience early on and apply the knowledge from my studies directly to real-world challenges. SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Hahn: Combining the strengths of Comet Yxlon’s software and Dragonfly’s AI powerhouse — I was the dedicated project manager to support the global technological cooperation of our two software environments to accelerate the 3D IC go to market challenge. My goal was to facilitate methodological collaboration to develop new software inspection workflows for the semiconductor industry.Looking back, I am proud of what we accomplished: building a cohesive team from different cultures, working across time zones, adapting to various working styles, and successfully launching our first product.SEMI: As a young professional in the industry, what is your greatest challenge? Hahn: One of the biggest challenges is the rapid pace of industry change. For development teams, this means shorter development cycles and closer collaboration with international customers. For young professionals, it's essential to maintain a continuous learning cycle to stay current and develop the ability to work effectively across diverse cultures. This ensures we understand the different customer requirements and can implement them effectively.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Hahn: Gaining practical experience alongside your studies as early as possible is crucial. Internships or working student positions offer valuable opportunities, and sometimes, it’s beneficial to proactively reach out to companies, even if no vacancies are advertised. For me, these experiences made my studies more engaging by linking theory to real-world applications and deepening my understanding of the subjects. Beyond acquiring practical skills and expanding your network, this approach helps clarify the career path you want to pursue after graduation.SEMI: How do you envision future work environments? Hahn: Working from home has increasingly become the standard in recent years. While offering many advantages, a significant challenge for companies is maintaining a sense of community. This is easier to achieve when employees are physically present, as in-person interactions tend to be more impactful. It raises the question of how companies can foster a strong sense of community and belonging in the long term without requiring workers to be physically present in the office.SEMI: What impact has the 20 Under 30 Award had on your career? Hahn: Overall, this recognition has been both a validation of my efforts and a source of inspiration to continue pushing the boundaries in my work. Beyond the recognition of my contributions and achievements, the award provided a platform to engage with like-minded young professionals beyond my usual network.Following 20 Under 30 JourneysKai Hahn’s journey from a bachelor’s student to a leading Project Manager at Comet, Industrial X-Ray Division is a testament to his dedication, innovation, and leadership in the semiconductor industry. His achievements in integrating teams, developing cutting-edge solutions, and driving organizational transformation highlight the significant impact young professionals can make. Hahn’s story is an inspiring example of how passion and perseverance can lead to remarkable accomplishments. As he continues to push boundaries and shape the future, SEMI looks forward to seeing the continued influence of his work in the semiconductor field.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is not only excelling in their respective fields but also shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa 2023. Nominations for the 20 Under 30 program at SEMICON Europa 2024 close on September 30.Maria Daniela Perez is Communications Manager at SEMI Europe.

Silicon carbide (SiC), with its wide band gap and high thermal conductivity, is increasingly favored for semiconductor power applications across several fast-growing industries. Its ability to operate at higher voltages and frequencies enables significant efficiency gains, particularly in e-mobility, where SiC offers key advantages in size, weight, and speed compared to traditional silicon-based power devices.However, as promising as SiC is, the industry still faces critical challenges in scaling to meet growing demand. Key barriers include cost, reliability, and manufacturing capacity, all of which must be addressed for SiC to fully mature.SEMI spoke with Entegris Senior Director - Advanced Technology Engagements, Office of the CTO Mark Puttock, Ph.D., to discuss the challenges of scaling SiC power chip manufacturing from a material supplier’s perspective. Puttock shared insights ahead of his presentation at the Entegris session, Cultivating a Thriving SiC Market: Tackling Key Challenges Across the Value Chain, taking place on November 14, 2024, at SEMICON Europa in Munich, Germany. Don’t miss the opportunity to engage with experts from Entegris and other industry leaders. Registration is now open. SEMI: Global megatrends like environmental crises and AI drive the necessity for SiC power semiconductors. What is the current status? Puttock: The increasing demand for efficient power electronics — fueled by global megatrends such as vehicle electrification, environmental de-carbonization, and the rise of power-hungry AI chips — drives the necessity of wide bandgap semiconductors. SiC offers advantages of weight, size, and speed over traditional silicon (Si) solutions, which are particularly vital in automotive applications 600V and above. However, SiC chip manufacturing has not reached the maturity of silicon-based processing. Greater maturity will help reduce costs, which will accelerate adoption in the market.SEMI: What are the main challenges in scaling SiC?Puttock: Challenges in scaling SiC power chip manufacturing to high volumes are not surprising. That’s because high volume producers have not been operating long enough to resolve early-stage issues. From a material perspective, SiC is more challenging to manage compared to Si. The challenges we identify include:Chemical Mechanical Planarization (CMP): SiC is nearly as hard as diamond and significantly harder than Si, making it challenging to achieve a high removal rate while maintaining both planarity and low defectivity. This step is crucial toward the end of the wafering process and before the epitaxial growth of device layers.Handling: SiC is more brittle than Si, making it more susceptible to damage or breakage.Implantation: SiC is more difficult to implant than Si, requiring higher temperatures and the use of aluminum instead of boron as a P-type implant species. Additionally, it is a significant challenge to achieve a reliable aluminum source with a long and stable lifetime.Thermal Processing for Wafer Growth and Epitaxy Processes: SiC processes run hotter than Si ( 2000° C for wafering, 1500° C for epitaxial growth), demanding resilient chamber parts to achieve good lifetimes.Sustainability: Because SiC is extremely hard, the CMP process requires significant amounts of slurry. Improving slurry recycling and wastewater management continues to be a challenge.On October 29, we will address these issues in our webinar, “Challenges in Scaling SiC Power Chip Manufacturing: A Material Supplier's Perspective” This session will provide valuable insights and considerations for advancing maturity in high-volume SiC power chip manufacturing. SEMI: Can you elaborate on the challenges associated with CMP for SiC wafers? Puttock: SiC wafers are challenging to process, requiring specialized materials and methods compared to traditional silicon. Defects in the SiC wafer crystal during non-optimized CMP processing can propagate into the device epitaxial layers. This leads to yield loss, increased electrical resistance, reduced performance, and wasted power.SiC wafers must be cut, ground, lapped, and polished to create the necessary surface properties before depositing active layers. As the demand for these devices grows, optimizing the CMP process is essential to ensure the desired surface quality and planarity required for device fabrication. For a deeper understanding of these challenges, we recommend downloading our latest white paper, “Solving CMP Challenges in High-Volume SiC Production,” which covers:Achieving maximum smoothness with high removal ratesReducing the total cost of ownership Optimizing CMP slurry and pads for the unique wafer chemistry and topology of SiC wafersSEMI: What do you mean by optimizing slurry for SiC CMP?Puttock: CMP slurry typically consists of abrasive nanoparticle powder dispersed in a chemically reactive solution. The objective is to achieve a smooth, defect-free surface (less than 1 A Ra) with a high removal rate (greater than 7 µm/m).Traditionally, achieving high removal rates and smooth surfaces required two separate slurries. This approach sometimes forced SiC wafer manufacturers to choose a defect-free surface over a faster, more efficient CMP process, depending on their fab capabilities. Today, optimization allows SiC wafer manufacturers to achieve both high polishing capacity and good final surface quality using a single slurry.Additionally, while the slurry is the most critical part of the CMP process, the pad must be compatible with the application. This ensures the desired planarity while also preventing scratches or contamination of the SiC wafer surface. Research shows that optimized thermoplastic polyurethane CMP pads outperform traditional thermoset polyurethane pads. The optimized pads minimize surface damage and enhance removal rates due to their bulk hardness.SEMI: What are the future challenges for SiC devices? Puttock: SiC devices are increasingly favored for their superior energy efficiency and reduced environmental impact. However, the SiC manufacturing process presents challenges due to its high-temperature operations, which consumes significant amounts of energy and shortens the lifespan of chamber components. To address this, improving efficiency in these processes will be crucial in the coming years.Recycling is another important challenge. For example, CMP slurries present an opportunity for water recycling and conservation. At Entegris, we are committed to this issue and are actively collaborating with key industry players to enhance material circularity and prioritize sustainability in our new product development.SEMI: How is Entegris contributing to advancements in SiC technology, and what initiatives or partnerships do you have planned for the near future? Puttock: Entegris is an active member of the SEMI Global Automotive Advisory Council (GAAC) and participates in a working group focused on SiC with key industry leaders such as Volkswagen, BMW, Porsche Consulting, onsemi, Infineon, STMicroelectronics, and others. Our engagement spans the entire semiconductor supply chain, collaborating with integrated device manufacturers and original equipment manufacturers in fabs worldwide. Additionally, we recently announced our latest long-term agreement with onsemi, which underscores our commitment to advancing SiC technology.SEMI: What are your expectations regarding your participation at SEMICON Europa? Puttock: SEMICON Europa is a unique platform to connect with the semiconductor and automotive ecosystems. Last year, we organized a highly successful SiC session in collaboration with SEMI at both SEMICON West and SEMICON Europa, focusing on “Connecting the Automotive Ecosystem Towards More Mature SiC Manufacturing.”This year, we will continue the discussion with industry leaders during our session, “Cultivating a Thriving SiC Market: Tackling Key Challenges Across the Value Chain.” Our goal is to provide insights and propose solutions that will enable SiC power chips to achieve their anticipated role in future technology ecosystems.We will present alongside Porsche Consulting, and the talks will be followed by a panel discussion that will explore the current state and future prospects of SiC technology in power electronics. We invite visitors to join us at the Executive Forum on Thursday, November 14, from 1:40 – 3:00 p.m. and to visit us at Silicon Saxony booth 219 in Hall C1.About Mark PuttockMark Puttock, Ph.D., is the senior director of advanced technology engagements in the office of the CTO at Entegris. He has worked in the semiconductor industry for over 30 years with a background in physics and plasma processing. As a team member of the Entegris CTO office since 2014, Mark has followed technology trends and collaborated with Entegris’ global product development teams to develop timely and differentiated new materials, chemistries, and components for all the world’s semiconductor manufacturers. Maria Daniela Perez is Communications Manager at SEMI Europe.