SMC Korea 2021
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Date | May 12(Wed) - 18(Tue), 2021
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Theme | Materials: Driving a New Leap Forward
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โ SEMI provides the presentation materials agreed by speakers.
โ These files are only for SMC Korea 2021 attendees. Please do not share or distribute.
[LIVE] Collaboration
- Advanced Material Development in Perspectives of CMP & Cleaning Process for Semiconductor / Hyun-Goo Kang, SK hynix
- Special Singularity beyond Material; Winter but Opportunity is Coming / Yun-Ho Kim, Samsung Electronics
[On-demand] Keynote
- Materials for Sub-5-nm Semiconductor Devices / Christoph Adelmann, imec
- Trends and Observations in Materials Quality at Advanced Process Nodes / Bruce Tufts, Intel
- Cost-Effective Fab Material Qualification with Un-patterned Wafer Inspection / Jijen Vazhaeparambil, KLA
[On-demand] Session 1: Emerging Materials and Patterning
- 0.33 NA EUV Systems for High Volume Manufacturing / Myoung-Kuy Lee, ASML (will not be shared)
- Stochastic Effects on EUV CAR Systems: Investigation of Materials Impact / Takanori Kawakami, JSR Corporation
- Mitigation of Pattern Collapse in EUVL / Kazuma Yamamoto, Merck
- Removal of Trace Metals from High Temperature Isopropyl Alcohol (IPA) / Ashutosh Bhabhe, Entegris
[On-demand] Session 2: Materials Integration and Challenges
- Current Demands on Wafers for CIS / Young Hun Kim, SK Siltron
- Gate-All-Around Transistors: Fundamentals & Structures / Youngwoo Park, Tokyo Electron
- Thermal Atomic Layer Etching โ An Emerging and Enabling Etching Technology / Andreas Fischer, Lam Research
- Selective ALD in a Continuous World, New Techniques and Advancements / Mihaela Balseanu, Applied Materials
[On-demand] Session 3: New Waves in Materials
- Advanced Packaging : Trends, Technologies and Challenges / JinSuk Jeong, Amkor Technology
- Engineered Substrates for New Waveforms and New Applications / Luis Andia, Soitec
- Next Generation Metallization Solutions for Advanced Packaging / Marco Arnold, BASF
[On-demand] Session 4: Market Trends
- Semiconductor Market Outlook: Strong Growth Ahead / Bob Johnson, Gartner
- Advanced Packaging Growth: Focus on New Package Approaches / Brandon Prior, Prismark
- Materials Demand in the Next Supercycle / Mark Thrisk, Linx Consulting