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In the past decade, high volume IC packaging has shifted from the era of ceramic packages to organic substrate-based packages, especially the plastic ball grid array (PBGA). The shift from ceramic to laminate substrates for packaging central processing unit (CPU) microprocessors facilitated this migration to organic substrates by providing a volume application that enabled the technology to mature faster. Flex circuit or tape substrates are a niche market for large die packaging, but are also used in volume for chip scale packages (CSPs) including some stacked die packages. Increasingly many of the new CSP designs are using a rigid laminate substrate rather than flex circuit.
The SEMI Industry Research and Statistics Group provides market data and research reports covering semiconductor materials, packaging materials, and fabs. We collect actual data from suppliers around the world following strict professional standards of confidentiality. Our reports help the industry make important investment, strategic and planning decisions by providing timely and accurate market research and market forecasting programs. For more information, visit www.semi.org/marketinfo or contact the SEMI Industry Research and Statistics Group at [email protected]
Keywords: Substrate, Market Research, Fabrication, Materials, Packaging, Investment, Forecast, Die Attach, Organic, PBGA